Inventors:
Richard Hsiao - San Jose CA
Edward Hin Pong Lee - San Jose CA
Timothy J. Moran - San Jose CA
Joseph Francis Smyth - Aptos CA
Howard Gordon Zolla - San Jose CA
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 5127
Abstract:
To protect the MR read head element from ESD damage during wafer level manufacturing, a lead from the MR element is electrically connected to one or both of the read head element shields during manufacturing. In a preferred embodiment of the present invention, the electrical connection is fabricated in the kerf area between adjacent magnetic heads as they are fabricated upon a wafer substrate. Thereafter, when the magnetic heads are separated by saw cutting through the kerf areas, the electrical connections are thereby removed, such that the MR element electrical leads and the shields are electrically isolated. In an alternative embodiment, one or more of the shields, as well as the MR element leads can also be electrically connected to the substrate upon which the magnetic head is fabricated. In further alternative embodiments, the electrical connection between one or more of the shields and the MR element electrical lead can be fabricated within the magnetic head area, rather than in the kerf area, and a suitable resistance is fabricated into the interconnecting circuit. In this embodiment, the electrical interconnection between the MR element electrical lead and one or more of the shields has a pre-designed electrical resistance and it remains in the magnetic head following fabrication.