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Richard L Tseng, Age 7420326 E Crestline Dr, Walnut, CA 91789

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Related to:
Zhi Li 25 Chi Fu Ku 46 Zhi Li

Richard Tseng Phones & Addresses

20326 E Crestline Dr, Walnut, CA 91789 (626) 201-2506

Work

Company: Digital solutions group Address: 19255 San Jose Ave., Whittier, CA 91748 Phones: (626) 810-5117 Position: Administrator Industries: Management Services

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Richard Tseng resumes & CV records

Resumes

Richard Tseng Photo 35

Sr. Director Of Web & Ecommerce (Cwd) At Rakuten Buy.com

Position:
Sr. Director of Web & eCommerce (CWD) at Rakuten Buy.com
Location:
Greater Los Angeles Area
Industry:
Retail
Work:
Rakuten Buy.com - Southern California since Feb 2013
Sr. Director of Web & eCommerce (CWD) Newegg.com (#12 on Internet Retailer Top 500) - Greater Los Angeles Area 2010 - Feb 2013
Director of Web & eCommerce Newegg.com - Greater Los Angeles Area 2008 - 2010
Senior Manager, Web, eCommerce & Marketing Newegg.com - Greater Los Angeles Area 2007 - 2008
Business Systems Analyst / Project Manager Independant Consultant 2002 - 2007
Web Developer
Education:
California State Polytechnic University-Pomona
Skills:
E-commerce, E-commerce Optimization, Product Management, Web Content Management, Web Content, Content Strategy, Website Merchandising, Conversion Optimization, A/B testing, Customer Experience, User Experience, E-commerce SEO, Social Media, Social Media Marketing, Web Analytics, Coremetrics Analytics, Google Analytics, Customer Acquisition, Customer Retention, Rich Media, Video, Enterprise Search, Personalization
Languages:
English
Chinese
Richard Tseng Photo 36

Vice President Of Marketing, Ecommerce And Technology

Location:
20326 east Crestline Dr, Walnut, CA 91789
Industry:
Consumer Electronics
Work:
Rakuten.com Nov 2013 - Nov 2014
Vice President of Marketing and Ecommerce at Rakuten.com Monoprice Nov 2013 - Nov 2014
Vice President of Marketing, Ecommerce and Technology Rakuten.com Feb 2013 - Nov 2013
Senior Director of Web and Ecommerce Newegg 2010 - Feb 2013
Director of Web and Ecommerce Newegg 2008 - 2010
Senior Manager, Web, Ecommerce and Marketing Newegg 2007 - 2008
Business Systems Analyst and Project Manager Independant Consultant (Self Employed) 2002 - 2007
Web Developer
Education:
The Collins College of Hospitality Management at Cal Poly Pomona
Bachelors, Bachelor of Science
Skills:
E Commerce, Web Analytics, Product Management, User Experience, Social Media, Online Marketing, Crm, Google Analytics, Content Management, Website Merchandising, Seo, Strategy, Analytics, Social Media Marketing, A/B Testing, E Commerce Seo, Management, Conversion Optimization, Customer Acquisition, Web Content, Affiliate Marketing, Online Advertising, Marketing Strategy, Content Strategy, Email Marketing, Web Content Management, Strategic Partnerships, Customer Experience, Customer Retention, B2B, Ppc, Cross Functional Team Leadership, Integrated Marketing, Coremetrics Analytics, Marketing, E Commerce Optimization, Rich Media, Enterprise Search, Personalization, Sem, Video, Search Engine Optimization, Customer Relationship Management
Languages:
English
Mandarin
Richard Tseng Photo 37

Richard Tseng

Richard Tseng Photo 38

Richard Tseng

Publications & IP owners

Us Patents

Heat Dissipating Device For Electronic Component

US Patent:
7304854, Dec 4, 2007
Filed:
Apr 15, 2005
Appl. No.:
11/107039
Inventors:
Richard Tseng - Fullerton CA, US
Rong-Che Chen - Tu-Cheng, TW
Yih-Jong Hsieh - Tu-Cheng, TW
Chien-Yi Lo - Tu-Cheng, TW
Assignee:
Foxconn Technology Co., Ltd. - Tu-Cheng, Taipei Hsien
International Classification:
H05K 7/20
US Classification:
361719, 361704, 361710, 165 803, 165185, 257706, 174 163
Abstract:
A heat dissipating device is used to be sandwiched between a motherboard and a chassis for transferring heat from the motherboard to the chassis. The heat dissipating device includes a body for contacting with a bottom side of the motherboard, and a plurality of wings extending from the body. Each wing includes a connecting section extending from the body and a contacting section extending further from the connecting section for contacting with the chassis. The body engages with the bottom side of the motherboard at a position corresponding to that a heat-generating electronic component is mounted to a top side of the motherboard. Heat generated by the electronic component is transferred to the chassis through the motherboard and the heat dissipating device. The heat dissipating device is formed by stamping a metal sheet with high heat conductivity.

Possible Relatives

Daniel T Tseng  Diana M Tseng  Edward K Tseng  Elaine Y Tseng  George L Tseng  Glen H Tseng  Hsiao S Tseng  Richard A Stamps  Richard A Standish  Richard L Standley 

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