Richard J EdwardsNew York, NY

2010027, Oct 28, 2010

Nov 18, 2008

12/743615

Eddy Chapoteau - Brooklyn NY, US
Richard Edwards - Cold Spring NY, US
Chester Swirski - Yorktown NY, US
Wolodymyr Zazulak - New Fairfield CT, US

Siemens Healthcare Diagnostics Inc. - Tarrytown NY

C12Q 1/37
G01N 33/53
G01N 33/546

435 71, 435 24

Particular aspects of the present invention relate to methods for detecting glycated hemoglobin in, for example, human whole blood, that are not affected by the presence of variation in amino acid sequence that can exist in hemoglobin β chains. The methods detect all glycated hemoglobin in a sample, regardless of the form of the hemoglobin that has been glycated, and thus detect glycated human Hemoglobin A, Hemoglobin S, and Hemoglobin C.

6042623, Mar 28, 2000

Jan 12, 1998

9/005862

Richard C. Edwards - Wesley Hills NY

Tokyo Electron Limited

H01L 2100
C25B 1300

29 2501

Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from a high vacuum chamber of a transfer module of a wafer processing cluster tool, or back end, through a single two-wafer loadlock. Preferably, with the wafers oriented horizontally throughout, two wafers are sequentially loaded into and simultaneously moved inbound to the high vacuum back end of the system, through one loadlock and sequentially moved into and simultaneously moved outbound through the same loadlock, the loadlock having a pair of water cooled supports for simultaneously actively cooling the two wafers. In both the atmospheric front end and vacuum back end environments, transfer arms load and unload the loadlock, and transfer wafers within the environments when all loadlocks are sealed. Preferably, two wafers are actively cooled in the loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in the loadlock.

5126028, Jun 30, 1992

Aug 22, 1990

7/570943

Steven D. Hurwitt - Park Ridge NJ
Israel Wagner - Monsey NY
Robert Hieronymi - Rock Cavern NY
Charles Van Nutt - Monroe NY
Richard C. Edwards - Ringwood NJ
Donald A. Messina - Valley Cottage NY

Materials Research Corporation - Orangeburg NY

C23C 1454

20419213

A sputter coating apparatus displays set and alternative machine parameters, entered or calculated from entered or measured data, for selection by the operator. The apparatus performs a sputter coating process to produce sputter coated articles in accordance with the selected machine parameters. Process parameters familiar to the person creating the process, such as desired coating thickness and desired deposition rate, may be entered by the operator. Measured data such as actual coating thickness at a plurality of points on a previously processed wafer may be entered by an operator or automatically measured from a wafer. Alternative machine parameters such as target sputtering power may be entered by an operator or calculated from entered process parameters or measured data. The operator selects and initiates a process in accordance with the selections by entering commands. The machine parameters control separately the sputtering from different regions of the sputtering surface of a one piece sputtering target by alternately energizing different plasmas over the different target regions and energizing the target in accordance with different machine parameters.

5380682, Jan 10, 1995

Nov 3, 1993

8/147666

Richard C. Edwards - Ringwood NJ
Michael S. Kolesa - Suffern NY
Hiroichi Ishikawa - Mahwah NJ

Materials Research Corporation - Orangeburg NY

H01L 2100
H01L 2102
H01L 21302
H01L 21463

437225

A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.

4422048, Dec 20, 1983

Jul 23, 1982

6/401108

Richard K. Edwards - Oradell NJ

H03F 134
H03F 3181

330109

A multiple band frequency response controller for use in audio applications, to precisely control and equalize audio system response. The frequency response controller shown will adjust response in ten octave bands. The unique feedback system used will generate response curves of increased smoothness and accuracy. In addition, the method shown will be readily adaptable to external control by analog or digital control signals.

5944857, Aug 31, 1999

May 8, 1997

8/853172

Richard C. Edwards - Wesley Hills NY
Marian Zielinski - Washington Twp. NJ

Tokyo Electron Limited - Tokyo

H01L 2100

29 2501

Wafers from plural non-vacuum multiple wafer carriers are loaded and unloaded in an atmospheric front end of a wafer processing machine and transferred to and from the high vacuum chamber of a transfer module of a wafer manufacturing cluster tool through a plurality of single wafer loadlocks. Preferably, with the wafers oriented horizontally throughout, wafers are moved inbound to the high vacuum atmosphere through one loadlock and moved outbound through another loadlock, the outbound loadlock also actively cooling the wafer. In both the atmospheric and vacuum environments, transfer arms load and unload the loadlocks as often as possible when the other loadlock or loadlocks are sealed, and transfer wafers within the environments when all loadlocks are sealed. Preferably, the wafers are actively cooled in the outbound loadlock. Preferably also, wafers are passed through a wafer aligner after being removed from a carrier and before placed in a loadlock.

5259881, Nov 9, 1993

May 17, 1991

7/701800

Richard C. Edwards - Ringwood NJ
Michael S. Kolesa - Suffern NY
Hiroichi Ishikawa - Mahwah NJ

Materials Research Corporation - Orangeburg NY

H01L 2100
H01L 2102
C23C 1600

118719

A wafer processing cluster tool, having one or more load-locks, is provided with one or more batch preheating modules that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine. The loading, unloading, handling and processing of wafers in the machine can occur while other wafers are being preheated. The preheat module has a vertically moveable rack and is loaded with various sized batches of wafers with no vacant positions between them. Wafer shaped shields may occupy positions adjacent top and bottom wafers to cause them to heat the same as other wafers in the rack. Infrared lamps positioned outside of quartz windows heat wafers in the preheat module. The rack may rotate to improve heating uniformity. Temperature sensors, such as pyrometers, that do not contact the wafers being preheated, measure temperature for control of the heating of the lamps.