Robert James Sanville, Age 548182 Emerald Forest Ct, Sanford, FL 32771

Robert Sanville Phones & Addresses

8182 Emerald Forest Ct, Sanford, FL 32771

2749 Zodiac St, North Port, FL 34286 (941) 426-6061

Lake Mary, FL

266 Endicott St, Laconia, NH 03246 (603) 366-9302

Northfield, NH

Woodbine, KY

Seminole, FL

Sarasota, FL

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Work

Company: J-pac medical 2007 Position: Lead process engineer / tool room manager

Education

School / High School: BMG University 2001

Skills

Certified Six Sigma Black Belt

Mentions for Robert James Sanville

Career records & work history

Lawyers & Attorneys

Robert Sanville Photo 1

Robert Sanville - Lawyer

ISLN:
920124671
Admitted:
1990

Robert Sanville resumes & CV records

Resumes

Robert Sanville Photo 18

Robert Sanville - Northwood, NH

Work:
J-Pac Medical 2007 to 2000
Lead Process Engineer / Tool Room Manager
Freudenberg NOK - Manchester, NH 2004 to 2007
Process/Manufacturing Engineer
MedSource Tech - Laconia, NH 2001 to 2003
Manufacturing Engineer, Assembly
POLYCLAD LAMINATES - Franklin, NH 2000 to 2001
Process Engineer, Fabrication Area - Six Sigma Certified Black Belt
UNI-CAST DIVISION OF RUGER - Londonderry, NH 1999 to 2000
Engineering Manager
B.K. MACHINE COMPANY INC - Hill, NH 1995 to 1999
Owner/Manager
WYMAN-GORDON CORPORATION - Tilton, NH 1986 to 1995
Manufacturing Engineer
Skills:
Certified Six Sigma Black Belt

Publications & IP owners

Us Patents

Two-Layered Embedded Capacitor

US Patent:
2002004, Apr 25, 2002
Filed:
Mar 30, 2000
Appl. No.:
09/538823
Inventors:
Thomas Williams - Concord NH, US
William Varnell - Concord NH, US
Robert Sanville - Laconia NH, US
International Classification:
H01G004/35
US Classification:
361/302000
Abstract:
A novel capacitor foil and printed circuit board intermediate made using that foil are disclosed. The capacitor foil is a two-layer construction having a conductive layer and a partially cured bonding layer having a high dielectric constant. The high dielectric bonding layer is formed with epoxy or other polymer and is loaded with capacitive ceramic particles or pre-fired ceramic forming particles. The resulting capacitor foil may be applied to a laminate having copper patterns thereon to define a PCB intermediate containing at least one buried capacitor device. Multiple layers of capacitance material also can be used to increase the overall capacitance of the board.

Circuit Board Prepreg With Reduced Dielectric Constant

US Patent:
5670250, Sep 23, 1997
Filed:
May 16, 1995
Appl. No.:
8/442119
Inventors:
Robert J. Sanville - Northfield NH
Carl P. Kernander - Lee NH
Assignee:
Polyclad Laminates, Inc. - West Franklin NH
International Classification:
B32B 516
B32B 900
D02G 300
H05K 109
US Classification:
428323
Abstract:
This invention involves a prepreg composition and procedure for use in forming printed circuit boards with reduced and uniform dielectric constant, improved thermal expansion characteristics, and uniform appearance. The prepreg composite is a resin impregnated substrate and has a reduced dielectric constant as low as 3. 5. It contains 5-30% by resin volume of hollow inorganic microsphere filler whose diameters are less than 40 micrometers, and the uniform distribution of the hollow inorganic microspheres is controlled by the presence of hydrophobic fumed silica or other similar flow modifier.

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