Robert S Tolles Deceased8951 Point Charity Dr, Sand Point, MI 48755

6371836, Apr 16, 2002

Sep 20, 2000

09/666511

Brian J. Brown - Palo Alto CA
Robert Tolles - Santa Clara CA
James C. Nystrom - Palo Alto CA
Doyle Bennett - Santa Clara CA
Madhavi Chandrachood - Sunnyvale CA

Applied Materials, Inc. - Santa Clara CA

B24B 100

451 56, 451444

An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e. g. , grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pads surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.

2014004, Feb 20, 2014

Aug 10, 2013

13/964056

Orion Leland - Fremont CA, US
Steve Peterson - Milpitas CA, US
Steve Babayan - Los Altos CA, US
Keenan K. Leon Guerrero - Boise ID, US
Steve Zuniga - Soquel CA, US
Robert Tolles - San Jose CA, US

GTAT Corporation - Nashua NH

B32B 37/10

156249, 156247, 1565831

Methods and apparatus are provided for bonding a thin lamina to a carrier. In some embodiments, a first side of the lamina is separably contacted to a support plate. A first carrier having a first side with a layer of adhesive material is contacted to the second side of the thin lamina. The lamina is fixed to the first carrier, where the fixing includes a first application of heat and pressure to a portion of the lamina and the first carrier. The support plate is removed, and a second application of heat and pressure are applied to the lamina and the first carrier. The second application of heat and pressure promotes an adhesive bond between the lamina and the first carrier. The second application of pressure comprises moving the lamina, the first carrier and a cover sheet between a pair of rollers.

5599423, Feb 4, 1997

Jun 30, 1995

8/497362

Norman W. Parker - Fairfield CA
Robert D. Tolles - Santa Clara CA
Harry Q. Lee - Mountain View CA

Applied Materials, Inc. - Santa Clara CA

H01L 2100

1566361

Apparatus and concomitant method for simulating a chemical mechanical polishing (CMP) system containing a polishing pad, a chuck for supporting a substrate, a positioner for positioning the polishing pad with respect to the substrate, a chuck rotator for rotating the chuck, and a polishing pad rotator for rotating the polishing pad. The CMP system simulation method comprises: defining polishing pad and substrate parameters; defining simulation parameters; determining, in response to said polishing pad, substrate and simulation parameters, a polishing result; and displaying the polishing result. Additionally, the simulation optimizes selected parameters to achieve a specified polishing non-uniformity across a substrate. Also, the simulation and optimization routines are interfaced to CMP system hardware to optimally control a substrate polishing process to achieve predetermined substrate polishing non-uniformity.

6080046, Jun 27, 2000

Apr 10, 1998

9/058945

Norm Shendon - San Carlos CA
Ilya Perlov - Santa Clara CA
Eugene Gantvarg - Santa Clara CA
Harry Q. Lee - Mountain View CA
Robert D. Tolles - Santa Clara CA
Sasson Somekh - Los Altos Hills CA

Applied Materials, Inc. - Santa Clara CA

B24B 100

451 54

A wafer storage and wafer transfer system adjunct to a multi-station chemical mechanical polishing system. Multiple wafers are brought to the system stored in a cassette. A claw member attached to an overhead arm picks up the cassette and deposits it in a water-filled tub next to the polishing system, thereby submerging the wafers in the water with a generally vertical orientation. A blade member attached to the same arm has a recess formed in its surface connected to a vacuum generator powered by positive fluid pressure to thereby selectively apply a vacuum to the recess to vacuum chuck a wafer. The blade member vacuum chucks a wafer under the water, picks it out of the water, and deposits it on a pedestal in polishing system. One of several wafer heads on a rotating carousel picks up the wafer from the pedestal and carries it to one or more of the polishing stations for polishing. After completion of polishing, the wafer head redeposits the wafer on the pedestal.

6135868, Oct 24, 2000

Feb 11, 1998

9/021765

Brian J. Brown - Palo Alto CA
Robert Tolles - Santa Clara CA
James C. Nystrom - Palo Alto CA
Doyle Bennett - Santa Clara CA
Madhavi Chandrachood - Sunnyvale CA

Applied Materials, Inc. - Santa Clara CA

B24B 2118

451443

An improved chemical-mechanical polishing method and apparatus is provided. A brush is employed to continually brush slurry particles from surface features, e. g. , grooves, on a polishing pad. In this manner slurry is prevented from becoming compacted within the grooves as the slurry passes beneath and is subjected to compressive forces of a wafer polishing head. The invention may be practiced by use of a stationary brush operatively coupled to the polishing pad surface, or by an improved conditioning assembly having both a diamond surface for conditioning the polishing pad and a brush for cleaning the pad's surface features. The brush portion of the conditioning assembly may or may not rotate as it is scanned across the surface of the polishing pad.