Sae Jung Lee, Age 45Bellerose, NY

2022024, Aug 4, 2022

Mar 1, 2022

17/683707

- Beijing, CN
Youmin Wang - Berkeley CA, US
Sae Won Lee - Mountain View CA, US

BEIJING VOYAGER TECHNOLOGY CO., LTD. - Beijing

G02B 26/08
B60R 1/12
G01S 7/481
G01S 17/931

Embodiments of the disclosure provide a micromachined mirror assembly having multiple coating layers. In one example, the micromachined mirror assembly includes a micro mirror having a first thermal expansion coefficient, a reflective layer having a second thermal expansion coefficient, and a compensation layer having a third thermal expansion coefficient. The reflective layer is disposed on a top surface of the micro mirror and is reflective to incident light of the micromachined mirror assembly. The compensation layer is disposed on the reflective layer and is transparent to the incident light of the micromachined mirror assembly. The first thermal expansion coefficient is between the second thermal expansion coefficient and the third thermal expansion coefficient.

2020020, Jun 25, 2020

Dec 21, 2018

16/228819

- Mountain View CA, US
Youmin Wang - Berkeley CA, US
Sae Won Lee - Mountain View CA, US

DiDi Research America, LLC - Mountain View CA

G02B 26/08
B60R 1/12
G01S 17/93
G01S 7/481

Embodiments of the disclosure provide a micromachined mirror assembly having multiple coating layers. In one example, the micromachined mirror assembly includes a micro mirror having a first thermal expansion coefficient, a reflective layer having a second thermal expansion coefficient, and a compensation layer having a third thermal expansion coefficient. The reflective layer is disposed on a top surface of the micro mirror and is reflective to incident light of the micromachined mirror assembly. The compensation layer is disposed on the reflective layer and is transparent to the incident light of the micromachined mirror assembly. The first thermal expansion coefficient is between the second thermal expansion coefficient and the third thermal expansion coefficient.

2020002, Jan 23, 2020

Jun 4, 2019

16/430964

- Sunnyvale CA, US
Sae Won Lee - Santa Clara CA, US

G02B 7/18
G02B 26/08

A Micro-Electromechanical System (MEMS) device having improved thermal management, and methods of fabricating the same are described. Generally, the device includes a piston layer suspended over a surface of a substrate by posts at four corners thereof, the piston layer including an electrostatically deflectable piston and a number of flexures through which the piston is coupled to the posts. A faceplate including an aperture through which the piston is exposed is suspended over the piston layer. Thermal sinking structures project from the surface of the substrate and extend through void spaces between the posts, the flexures and the piston of the piston layer to provide thermal management of the piston layer. The thermal posts substantially fill the void spaces without contacting either the flexures or the piston, and without altering a deflection gap between the piston and the surface of the substrate. Other embodiments are also described.

2018030, Oct 25, 2018

Jun 15, 2018

16/010148

- Sunnyvale CA, US
James Hunter - Campbell CA, US
Lars Eng - Los Altos CA, US
Sae Won Lee - Santa Clara CA, US

G02B 26/08
G02B 5/08

A high power handling optical modulator and methods of fabricating the same are described. The method includes forming a number of electrostatically deflectable elements over a surface of a substrate, and forming a non-metallic, multilayer optical reflector over each electrostatically deflectable element. The multilayer optical reflector includes at least a first layer of high index material having a high index of refraction, a second layer of a low index material having a low index of refraction formed over the first layer, and a third layer of high index material also having a high index of refraction formed over the second layer. Generally, the high index materials and low index material are selected and deposited to maintain planarity of the multilayer optical reflector at operating temperature. In one embodiment, the high and low index materials include silicon-germanium and air respectively. Other embodiments are also described.