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Scott R Doran, Age 4564 Middle St, Boston, MA 02127

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Known as:
Scott Robert Doran
Related to:
Thomas E Hogan 57 Christine D Hogan 56

Scott Doran Phones & Addresses

64 Middle St, Boston, MA 02127 (617) 268-4783

64 Middle St APT 1, South Boston, MA 02127 (617) 835-5354

Abington, MA

64 Middle St, Boston, MA 02127 (617) 835-5354

Work

Company: Flaherty painting 1998 Position: Interior/exterior painter

Education

School / High School: Arts Institute Communication College- Brookline, MA 1998 Specialities: Multimedia

Emails

s***[email protected]

Mentions for Scott R Doran

Scott Doran resumes & CV records

Resumes

Scott Doran Photo 42

Controller

Location:
1000 Winter St, Waltham, MA 02451
Industry:
Accounting
Work:
Bind Therapeutics Jan 2014 - Jun 2015
Senior Manager Sec Reporting Neurometrix Jan 2014 - Jun 2015
Controller Cfgi Jul 2011 - Dec 2013
Senior Manager Pwc 2004 - Aug 2011
Manager
Education:
Northeastern University 2004
D'amore - Mckim School of Business at Northeastern University 2003 - 2004
Master of Business Administration, Masters, Accounting Massachusetts Institute of Technology
Scott Doran Photo 43

Scott Doran

Scott Doran Photo 44

Scott Doran

Scott Doran Photo 45

Scott Doran

Scott Doran Photo 46

Scott Doran

Location:
United States
Scott Doran Photo 47

Scott Doran

Location:
United States
Scott Doran Photo 48

Scott Doran - South Boston, MA

Work:
Flaherty Painting 1998 to 2000
Interior/Exterior Painter BGI Incorporated - Waltham, MA 2006 to 2009
Technician Flaherty Painting - Boston, MA 2002 to 2006
Interior/exterior painting Flaherty Painting - Boston, MA 2004 to 2005
Photographer Flaherty Painting - DORCHESTER, MA 2000 to 2002
Voice and data entry
Education:
Arts Institute Communication College - Brookline, MA 1998 to 2000
Multimedia

Publications & IP owners

Us Patents

Coplanar Packaging Techniques For Multichip Circuits

US Patent:
5032543, Jul 16, 1991
Filed:
Jun 17, 1988
Appl. No.:
7/208058
Inventors:
Jerry G. Black - Lincoln MA
David K. Astolfi - Littleton MA
Scott P. Doran - Wakefield MA
Daniel J. Ehrlich - Lexington MA
Assignee:
Massachusetts Institute of Technology - Cambridge MA
International Classification:
H01L 2156
US Classification:
437219
Abstract:
A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.

Possible Relatives

David D Doran  Daniel R Doran  Delores M Doran  Danielle J Doran  Dennis J Doran  Erik M Doran  Estelle A Doran  Scott S Stanard  Scott A Standefer  Scott C Johnston 

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