Shawn M Mahon, Age 51821 Haywood Dr, Howard Lake, MN 55349

6014320, Jan 11, 2000

Mar 30, 1998

9/050318

Shawn M. Mahon - Howard Lake MN
Theodore T. Paczkowski - Spring Park MN
Steven R. Schmieg - Victoria MN

Hei, Inc. - Victoria MN

H05K 114
H01R 909

361803

A high density circuit module construction uses a flex circuit attached to a substrate and folded over on it to provide higher packaging density while providing an increase in the surface area available for I/O pads. A substrate has components such as ICs mounted on one surface, and module I/O pads on the opposite surface. This surface also provides interconnects for the flex circuit. The flex circuit has one portion attached to the interconnect pads on one surface of the substrate. Another portion of the flex circuit folds around the substrate and is attached to the other side of the substrate. The surface area of this portion of the flex circuit provides in additional surface area for mounting circuit components, within essentially the same footprint area as the substrate. This module construction provides a higher density than prior art constructions, while providing a larger, unobstructed area for the I/O pads, which simplifies connecting the module into a larger assembly.

2018036, Dec 20, 2018

Aug 22, 2018

16/108440

- Eden Prairie MN, US
Douglas F. Link - Plymouth MN, US
Shawn Mahon - Howard Lake MN, US
Kevin Lammi - Minneapolis MN, US

H04R 25/00

A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate has a first surface and an opposing second surface, the second substrate supporting a second subsystem configured to perform a second function. The second surfaces face each other and at least one of the second surfaces supports one or more components. An interconnect layer is separate from and bonded to and between the first and second substrates. The interconnect layer comprises a window and a region peripheral to the window. The window is sized to accommodate the one or more components and the peripheral region comprising electrical pathways for electrically connecting the first subsystem and the second subsystem.

2018009, Apr 5, 2018

Oct 4, 2016

15/285299

- Eden Prairie MN, US
Douglas F. Link - Plymouth MN, US
Shawn Mahon - Howard Lake MN, US
Kevin Lammi - Minneapolis MN, US

H04R 25/00

A hearing assistance device comprises a system in package (SIP) disposed within an enclosure. The SIP module comprises a first substrate having a first surface and an opposing second surface, the first substrate supporting a first subsystem configured to perform a first function. A second substrate has a first surface and an opposing second surface, the second substrate supporting a second subsystem configured to perform a second function. The second surfaces face each other and at least one of the second surfaces supports one or more components. An interconnect layer is separate from and bonded to and between the first and second substrates. The interconnect layer comprises a window and a region peripheral to the window. The window is sized to accommodate the one or more components and the peripheral region comprising electrical pathways for electrically connecting the first subsystem and the second subsystem.