Steve Paul Lerner, Age 69PO Box 836, Carlisle, MA 01741

6907178, Jun 14, 2005

Jun 11, 2003

10/459338

Steve Lerner - Carlisle MA, US
Claudio Truzzi - Vottem, BE

G02B006/10

385131, 385 14, 333247

The invention provides an optoelectronic assembly for coupling an optical conductor to a light emitting surface of an optoelectronic semiconductor device on a substrate. The optoelectronic assembly includes a multilayer having a cavity adapted to receive and electrically connect the optoelectronic semiconductor device to the multilayer substrate and a groove leading to the cavity and being adapted to receive and optically connect the optical conductor to the light emitting surface of said optoelectronic semiconductor device. The optoelectronic semiconductor device and the optical conductor are precisely positioned within the cavity and the groove, respectively, so that light emitted from the light emitting surface of the optoelectronic semiconductor device couples to an optical surface of the optical conductor.

2011016, Jul 7, 2011

Jan 3, 2010

12/651475

Claudio Truzzi - Incourt, BE
Steve Lerner - Carlisle MA, US

H01L 31/02
H01L 31/18

136256, 438 98, 257E31113

A photovoltaic cell is provided herein. The photovoltaic cell includes a substrate whereby at least one interconnects may be formed over the substrate to facilitate energy conversion of the photovoltaic cell. In this embodiment, a conformal layer may be deposited over the interconnects, the conformal layer having a thickness of up to about 100 nm, and whereby the conformal layer is designed to permit external radiation to pass through to the interconnects so as to enhance the efficiency of energy conversion by at least about 25% as measured at standard test condition. In another embodiment, the interconnects of the photovoltaic cell may have tapered profile as to facilitate collection of diffused external radiation. In some instances, the tapered profile may facilitate in diverting the diffused external radiation to the interconnects for enhancing energy conversion of the photovoltaic cell. A method for method of manufacturing a photovoltaic cell is also provided.

2011019, Aug 11, 2011

Dec 31, 2010

12/983094

Claudio Truzzi - Incourt, BE
Steve Lerner - Carlisle MA, US

H01L 31/02
H01L 31/0264
H01L 31/18

136261, 136252, 438 98, 257E31124

A solar cell is provided herein. The solar cell includes a substantially transparent substrate, a substantially thin and transparent nickel-based conformal layer deposited on the substrate surface, and at least one interconnect formed on the conformal layer to facilitate energy conversion of the solar cell. The conformal layer can be made from a nickel-based material and is designed to enhance ohmic contact to the interconnect. The conformal layer can also act to facilitate the conversion of light energy into electrical current by the interconnect, while minimizing energy loss, such that the overall conversion efficiency of the solar cell can be improved. The conformal layer can further facilitate transmission of electrical current along the solar cell. A method for manufacturing a solar cell is also provided.

5381042, Jan 10, 1995

Apr 19, 1994

8/231341

Steve P. Lerner - Soquel CA
David S. Razu - Garland TX

Amkor Electronics, Inc. - Payoli PA

H01L 2302

257712

A low cost electronic device package having greatly improved heat dissipation capability. The package includes a heat slug, preferably formed from oxygen-free high-conductivity copper, that has a surface exposed outside the package. A simplified and inexpensive manufacturing method is described using a "drop in" technique. Using this technique, the size and shape of the heat slug is dependent only on the size and shape of the mold cavity; the package may have any number of leads and any size die. The heat slug is preferably formed with fins around its circumference so that the slug is self-aligning when it is dropped into the mold cavity. Preferably, slots are formed through the heat slug to provide improved encapsulant flow during the encapsulation process and interlocking between slug and encapsulant in the finished package. The heat slug may have at least one toughened surface on its circumference that interlocks with the encapsulant, helping to hold the heat slug in place and preventing contaminants from migrating to the interior of the package. Formation of encapsulant bleed or flash on the exposed heat slug surface are prevented by providing a dimensional mismatch between the heat slug and leadframe, and the corresponding height of the mold cavity that causes the leadframe tie bars to force the heat slug exposed surface against the mold cavity surface, producing a tight seal so that encapsulant is prevented from coming between those two surfaces.

2016035, Dec 8, 2016

May 31, 2016

15/169138

PRASHANTH MAKARAM - Burlington MA, US
STEVE LERNER - Carlisle MA, US

AlphaSzenszor Inc. - Burlington MA

G01N 27/414
H01L 21/48
H01L 23/04

A carbon nanotube sensor device includes one or more carbon nanotubes and a functionalization layer. An outer surface of the one or more carbon nanotubes is coated with the functionalization layer and the functionalization layer includes a chemical compound that binds to one or more specific analytes. Binding of the one or more specific analytes to the functionalization layer alters an electrical property of the carbon nanotube sensor device and contributes to their detection. The functionalization layer includes a first layer stacked onto an outer surface of the carbon nanotubes, a second layer stacked onto the first layer and a third layer stacked onto the second layer. The first layer enables stacking of a polymer onto the carbon nanotubes. The second layer includes the polymer and the third layer includes the chemical compound that binds to the one or more a specific analytes.