Stuart C Haden, Age 60241 Estelle Ln, Allen, TX 75002

6818835, Nov 16, 2004

Apr 22, 2003

10/420572

Stuart C. Haden - Lucas TX
Shaun L. Harris - McKinney TX
Michael C. Day - Allen TX
Christian L Belady - McKinney TX
Lisa Heid Pallotti - Plano TX
Paul T. Artman - Dallas TX
Eric C. Peterson - McKinney TX

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 103

174255, 174261

A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.

6825651, Nov 30, 2004

Apr 12, 2002

10/121356

Christian L. Belady - McKinney TX
Stuart C. Haden - Lucas TX
Paul A. Wirtzberger - Greenville TX

Hewlett-Packard Development Company, L.P. - Houston TX

G01R 114

324127

A test method characterizes current behavior of power components (e. g. , semiconductor packages) within an electronic system. One or more electrically conductive loops are formed with a first printed circuit board of the electronic system; these loops surround, at least in part, one or more electrical vias of the first printed circuit board. One or more power components connect to the vias to obtain power therethrough. Current characteristics are measured from one or more vias to assess transient and steady-state currents of components within the system. Power dissipation may be determined from the current. The loops may be formed within tracks of internal layers of the first printed circuit board, or a second printed circuit board may form the tracks.

7072185, Jul 4, 2006

Dec 21, 2004

11/021527

Christian L. Belady - McKinney TX, US
Gary W. Williams - Rowlett TX, US
Shaun L Harris - McKinney TX, US
Steven A. Belson - Plano TX, US
Eric C. Peterson - McKinney TX, US
Stuart C. Haden - Lucas TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 7/20

361704

Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.

7230468, Jun 12, 2007

Mar 10, 2004

10/797776

Brad Underwood - Plano TX, US
Stuart C. Haden - Lucas TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H03K 3/13

327292, 327298, 327407, 327526

In one embodiment, a distributed redundant control signal distribution system comprises a first control signal source co-located with a first set of control signal controlled circuit elements, at least one second control signal source co-located with a second set of control signal controlled circuit elements, at least one controller for providing control signals from the first control signal source to control both the first and second sets of controlled circuit elements, the controller operable for substituting signals from the second control signal source for signals from the first signal control source if the signals from the first control signal source become unavailable to either the first or second circuit elements.

7289328, Oct 30, 2007

Dec 21, 2004

11/021500

Christian L. Belady - McKinney TX, US
Gary W. Williams - Rowlett TX, US
Shaun L. Harris - McKinney TX, US
Steven A. Belson - Plano TX, US
Eric C. Peterson - McKinney TX, US
Stuart C. Haden - Lucas TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 7/20

361704, 257707, 257712, 361710, 361719

Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

7345885, Mar 18, 2008

Dec 22, 2004

11/023213

Brent A. Boudreaux - Highland Village TX, US
Shaun L Harris - McKinney TX, US
Eric C. Peterson - McKinney TX, US
Christian L Belady - McKinney TX, US
Gary W. Williams - Rowlett TX, US
Stuart C. Haden - Lucas TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 7/20
H01L 23/34
F28F 7/00

361721, 257706, 257707, 257712, 257713, 361704, 361710, 361715, 361719, 165 803, 165185

A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.

7475175, Jan 6, 2009

Mar 15, 2004

10/800837

David A. Klein - Carrollton TX, US
Christian L. Belady - McKinney TX, US
Shaun L. Harris - McKinney TX, US
Michael C. Day - Allen TX, US
Jeffrey P. Christenson - Plano TX, US
Brent A. Boudreaux - Highland Village TX, US
Stuart C. Haden - Allen TX, US
Eric Peterson - McKinney TX, US
Jeffrey N. Metcalf - Frisco TX, US
James S. Wells - Windsor CO, US
Gary W. Williams - Rowlett TX, US
Paul A. Wirtzberger - Greenville TX, US
Roy M. Zeighami - McKinney TX, US
Greg Huff - Plano TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01L 23/34
H01L 23/12
H05K 7/20
G06F 13/00

710100, 257706, 257711, 361702, 361707, 361719

An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.

7589560, Sep 15, 2009

Oct 19, 2006

11/583322

David Glen Edwards - Dallas TX, US
Brian Matthew Johnson - Allen TX, US
Mark A. Shaw - Sachse TX, US
Stuart C. Haden - Lucas TX, US

Hewlett-Packard Development Company, L.P. - Houston TX

H03K 19/0175
H03K 19/094
H03K 19/082

326 80, 326 62, 326 63, 326 81, 326 82, 326 83, 326 86, 326 90

Apparatus for configuring input/output signal levels of interfacing logic circuits operating at different voltage levels comprises: a logic circuit for operating at a first voltage level; a bank of input/output gates coupled to the logic circuit for interfacing input/output signals at a second voltage level, different from the first voltage level, to the logic circuit, the bank of gates including a port for setting the operational voltage level thereof; and a control circuit coupled to the port and governed by a control signal to configure the operational voltage level of the bank of gates to render the logic circuit and the interfacing input/output signals voltage level compatible.