Sunil S Murthy, Age 491451 Mecaslin St NW UNIT 8205, Atlanta, GA 30309

Sunil Murthy Phones & Addresses

College Park, MD

Sunnyvale, CA

Atlanta, GA

Hyattsville, MD

Greenbelt, MD

Mentions for Sunil S Murthy

Sunil Murthy resumes & CV records

Resumes

Sunil Murthy Photo 32

Data And Ai Offerings Strategy

Location:
21571 Regnart Rd, Cupertino, CA 95014
Industry:
Computer Software
Work:
IBM since Jun 2010
Cloud Computing Leader
Education:
Duke University - The Fuqua School of Business 2008 - 2009
University of Mysore 1992 - 1996
Skills:
Product Management, Competitive Analysis, Strategy, Cloud Computing, Saas, Enterprise Software, Mobile Computing, Mergers and Acquisitions, Business Case, Strategic Roadmaps, Marketing Strategy, Portfolio Management, Value Propositions, Management, Enterprise Architecture, New Business Development, Business Strategy, It Strategy, Soa, Start Ups, Leadership, Program Management, Go To Market Strategy, Solution Selling, Solution Architecture, Business Intelligence, Integration, Business Development, Software As A Service, Service Oriented Architecture
Interests:
Animal Welfare
Languages:
English
Sunil Murthy Photo 33

Sunil Murthy

Sunil Murthy Photo 34

Sunil Murthy

Publications & IP owners

Us Patents

Orientation-Independent Thermosyphon Heat Spreader

US Patent:
7556086, Jul 7, 2009
Filed:
Apr 6, 2001
Appl. No.:
09/828564
Inventors:
Yogendra Joshi - Burtonsville MD, US
Sunil S. Murthy - Greenbelt MD, US
Wataru Nakayama - Rockville MD, US
Assignee:
University of Maryland, College Park - College Park MD
International Classification:
F28F 7/00
US Classification:
165 803, 16510421, 16510426, 16510417, 16510433, 361700, 361714, 361715, 257715
Abstract:
Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader mounted to an electronics package comprises a central evaporator in hydraulic communication with a peripheral condenser, both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator substantially full at all orientations while leaving a void for accumulation of vapor in the condenser. A cover plate and a parallel base plate of generally similar dimension form the evaporator and condenser. Optionally, an opening in the base plate is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate may be formed with the electronics package from a single piece of material. A boiling enhancement structure is provided in the evaporator to encourage vapor bubble nucleation.

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