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Terry Munson
Terry Munson
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Terry MunsonEl Segundo, CA
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Us Patents
Solder Paste And Process
US Patent:
2006001, Jan 19, 2006
Filed:
May 27, 2005
Appl. No.:
11/140432
Inventors:
Lawrence Kay - Los Angeles CA, US
Terry Munson - Kokomo IN, US
Erik Severin - Pasadena CA, US
Terry Munson - Kokomo IN, US
Erik Severin - Pasadena CA, US
International Classification:
B23K 35/34
US Classification:
148023000
Abstract:
A solder paste comprises a lead-free solder powder, a flux and an active additive in the flux. The active additive comprises a material that scavenges metal oxide from molten solder, is a stable liquid at reflow soldering temperature, and has the ability to assimilate oxide of at least one metal in the solder. A preferred active additive is dimer acid present in the range of from 0.5 to 2.5% percent by weight of the paste. Sound joint are obtained when the paste is used in a reflow soldering process wherein the peak reflow temperature is preferably less than 245 C.
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