Thomas L Obert, Age 583460 E Nugget Canyon Pl, Tucson, AZ 85718

6982678, Jan 3, 2006

Apr 2, 2004

10/817400

Thomas L. Obert - Pomona CA, US
Kenneth W. Brown - Yucaipa CA, US
Alan A. Rattray - Alta Loma CA, US
John Gerstenberg - Lake Elsinore CA, US
James R. Gallivan - Pomona CA, US

Raytheon Company - Waltham MA

H01Q 13/00

343775, 343882

An apparatus includes a microwave source that produces a microwave feed beam, and a first pair of microwave sensors that each intercept and receive a portion of the microwave feed beam. The two microwave sensors are spaced apart from each other along a first-pair axis. A first phase-comparison device has as it inputs the output signals of the two microwave sensors, and as an output a first phase comparison of the first-sensor output signal and the second-sensor output signal. A first geometrical calculator has as an input the first phase comparison and as an output a geometrical relationship of the first-pair axis to an other feature. This geometrical relationship output may be used to generate a control signal that is used to alter the geometrical relationship. There may be additional microwave sensors operating in a similar manner but spaced to provide information for other geometrical axes or allow improvements in geometrical measurements.

8182103, May 22, 2012

Aug 20, 2007

11/841580

Kenneth W. Brown - Yucaipa CA, US
Andrew Kent Brown - Victorville CA, US
William Earl Dolash - Montclair CA, US
Darin Michael Gritters - Calimesa CA, US
Thomas Lee Obert - Claremont CA, US
Michael John Sotelo - Chino CA, US

Raytheon Company - Waltham MA

G02B 5/08

359849

A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

8248320, Aug 21, 2012

Sep 24, 2008

12/237312

James Stephen Mason - Richardson TX, US
Kenneth William Brown - Yucaipa CA, US
Andrew Kent Brown - Victorville CA, US
William Earl Dolash - Montclair CA, US
Darin Michael Gritters - Calimesa CA, US
Thomas Lee Obert - Claremont CA, US
Michael John Sotelo - Chino CA, US
Domingo Cruz-Pagan - Richardson TX, US

Raytheon Company - Waltham MA

H01Q 13/10

343771, 343786, 343754

A millimeter wave power source module may include N submodules, each of which includes M circuit devices, where M and N are greater than one. Each circuit device may have an output connected to a corresponding radiating element. Each submodule may include a power divider having K input ports and M output ports, where K is a factor of M. Each input port may be coupled to a corresponding receiving element, and each output port may be coupled to an input of a corresponding circuit device. Each submodule may include a heat spreader for removing heat from the circuit devices. The power source module may include a combination RF feed network and heat sink. The combination RF feed network and heat sink may include a wavefront expander to expand the RF input wavefront along at least one axis, and to direct the expanded wavefront to the receiving elements of the N submodules. The combination RF feed network and heat sink may also include a heat exchanger thermally coupled to the heat spreaders of the N submodules.

2003012, Jul 10, 2003

Jan 8, 2002

10/041364

Thomas Obert - Claremont CA, US
Kenneth Brown - Yucaipa CA, US
Thomas Drake - Yucaipa CA, US

H01G005/06

361/298300

A high power slide tuning capacitor () integrated into a circuit board adapted to function at RF and microwave frequencies. The capacitor () is comprised of a dielectric substrate () with a cavity () cut into a side of the substrate (); a ground plane () mounted on a bottom surface of the dielectric substrate (); a microstrip patch () mounted on a top surface of the dielectric substrate () and positioned above the cavity (); and a movable dielectric stub () which engages the cavity () such that a variable length of the stub () is positioned beneath the microstrip patch (). The microstrip patch () can be coupled to a desired circuit trace (), effectively forming a shunt capacitor to ground.

2014010, Apr 17, 2014

Oct 15, 2012

13/651789

- Waltham MA, US
Thomas L. Obert - Rancho Cucamonga CA, US
Michael J. Sotelo - Rancho Cucamonga CA, US
Darin M. Gritters - Rancho Cucamonga CA, US
Kenneth W. Brown - Rancho Cucamonga CA, US

RAYTHEON COMPANY - Waltham MA

H05K 1/11
H05K 3/22

174257, 216 16

An apparatus for conveying an electrical signal includes: a conductive pathway having a conductive material. The conductive material has a first edge and a second edge and is configured to convey the electrical signal. The apparatus also includes a resistive material in contact with at least a portion of the conductive pathway, covering an edge of the conductive pathway, and extending beyond the edge. The resistive material has a conductivity less than the conductivity of the conductive material.