Tung Lam resumes & CV records
Resumes
Tung Lam
Tung Lam
Tung M LamGarden Grove, CA
Tung Lam Phones & Addresses
Garden Grove, CA
12241 Lampson Ave, Garden Grove, CA 92840
Mentions for Tung M Lam
Publications & IP owners
Us Patents
Methods And Systems For Solid State Heat Transfer
US Patent:
2012023, Sep 20, 2012
Filed:
Mar 17, 2011
Appl. No.:
13/050555
Inventors:
Sidney W. K. Yuan - Los Angeles CA, US
Tung T. Lam - Fullerton CA, US
Tung T. Lam - Fullerton CA, US
Assignee:
The Aerospace Corporation - El Segundo CA
International Classification:
F25B 21/02
H01L 35/28
F28F 27/00
H01L 35/28
F28F 27/00
US Classification:
165277, 62 37
Abstract:
Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
Methods And Systems For Solid State Heat Transfer
US Patent:
2016016, Jun 16, 2016
Filed:
Nov 7, 2014
Appl. No.:
14/535770
Inventors:
- El Segundo CA, US
Tung T. Lam - Fullerton CA, US
Tung T. Lam - Fullerton CA, US
International Classification:
F25B 21/04
Abstract:
Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.
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