Victor White, Age 55Elmira, NY

2006014, Jul 6, 2006

Jul 29, 2005

11/192553

Frank J. Grunthaner - Glendale CA, US
Victor E. White - Altadena CA, US

C23F 1/00
C02F 1/44

210321840, 216056000, 216002000, 438022000, 257619000, 438977000

The present disclosure is directed, in part, to a method for fabricating a low-stress, ultra-thin membrane as well as the low-stress, ultra-thin membrane formed by this method. The method includes: layering a first layer on a semiconductor substrate; etching a hole in the first layer; layering a second layer on the membrane of the first layer and over the hole; and etching the substrate beginning from the bottom surface thereof, such that at least a portion of the substrate aligned with the hole in the first layer is removed. The first and second layers are made of substantially the same material, which will usually be silicon nitride, however, it is contemplated that other dielectric materials could be used, but it is preferred that the second layer has an amorphous structure. It is preferred that the second layer be formed with a slightly bubble-shape to help deflect stresses on the second layer. Generally, low pressure chemical vapor deposition will be used to create at least the first and second layers. As a result of this basic method, the second layer has an ultra-thin thickness. Among other devices, the ultra-thin membrane is useful in a device for detecting physical characteristics of a sample bombarded with electrons. In such a device, the ultra-thin, low-stress membrane is positioned adjacent a electron detector. The device may further include an evacuated chamber at least partially bounded by the ultra-thin low-stress membrane.

2011011, May 19, 2011

Nov 15, 2010

12/946839

Hrayr Karnig SHAHINIAN - Beverly Hills CA, US
Harish M MANOHARA - Arcadia CA, US
Victor E. WHITE - Altadena CA, US
Kirill V. SHCHEGLOV - Los Angeles CA, US
Robert S. KOWALCZYK - Valencia CA, US

H04N 13/00
A61B 1/07
A61B 1/055

348 45, 362574, 362583, 362555, 396 17, 348E13001

A dual objective endoscope for insertion into a cavity of a body for providing a stereoscopic image of a region of interest inside of the body including an imaging device at the distal end for obtaining optical images of the region of interest (ROI), and processing the optical images for forming video signals for wired and/or wireless transmission and display of 3D images on a rendering device. The imaging device includes a focal plane detector array (FPA) for obtaining the optical images of the ROI, and processing circuits behind the FPA. The processing circuits convert the optical images into the video signals. The imaging device includes right and left pupil for receiving a right and left images through a right and left conjugated multi-band pass filters. Illuminators illuminate the ROI through a multi-band pass filter having three right and three left pass bands that are matched to the right and left conjugated multi-band pass filters. A full color image is collected after three or six sequential illuminations with the red, green and blue lights.

2013030, Nov 14, 2013

Apr 17, 2013

13/865179

Keith D. Patterson - Los Angeles CA, US
Chiara Daraio - Pasadena CA, US
Eleftherios Gdoutos - Pasadena CA, US
Namiko Yamamoto - Pasadena CA, US
Risaku Toda - Pasadena CA, US
Victor E. White - Altadena CA, US
Harish Manohara - Arcadia CA, US
John B. Steeves - Pasadena CA, US

G02B 26/08

359298, 427100

A deformable mirror is configured to be deformed by surface-parallel actuation. In one embodiment, the deformable mirror includes a first piezoelectric active layer on a first surface of a substrate. The first piezoelectric active layer has a substantially uniform thickness across the first surface of the substrate. The mirror also includes a first electrode layer on the first piezoelectric active layer. The first electrode layer has a plurality of electrodes arranged in a first pattern and has a substantially uniform thickness across the first piezoelectric active layer. The mirror may further include a second piezoelectric layer on the first electrode layer, and a second electrode layer on the second piezoelectric layer. The electrodes of the first and second electrode layers are configured to supply a voltage to the piezoelectric active layers upon actuation to thereby locally deform the shape of the mirror to correct for optical aberrations.

2013030, Nov 14, 2013

Apr 17, 2013

13/865170

Keith D. Patterson - Los Angeles CA, US
Chiara Daraio - Pasadena CA, US
Eleftherios Gdoutos - Pasadena CA, US
Namiko Yamamoto - Pasadena CA, US
Risaku Toda - Pasadena CA, US
Victor E. White - Altadena CA, US
Harish Manohara - Arcadia CA, US
John B. Steeves - Pasadena CA, US

B32B 7/02
C04B 35/622
B22D 25/06
B32B 15/04

428593, 428116, 264255, 164 94, 219 6917

A micro-scaled bi-material lattice structure includes a frame comprising a first material having a first coefficient of expansion and defining a plurality of unit cells. The bi-material lattice structure further includes a plurality of plates comprising a second material having a second coefficient of expansion different from the first coefficient of expansion. One of the plates is connected to each unit cell. The bi-material lattice structure has a third coefficient of expansion different from both the first coefficient of the expansion and the second coefficient of expansion, and the bi-material lattice structure has a thickness of about 100 nm to about 3000 microns.

2021013, May 6, 2021

Nov 4, 2020

17/089629

- Pasadena CA, US
Victor E. White - Altadena CA, US
Kalind C. Carpenter - Pasadena CA, US
Douglas C. Hofmann - Altadena CA, US

California Institute of Technology - Pasadena CA

F16B 2/00
C22C 45/10
C22C 45/00
B22D 21/00

Bulk metallic glass-based gripping arrays of nano- or micro-scale grippers are described, along with the methods of fabrication and use thereof. BMG-based gripping arrays can be fabricated via facile and scalable thermoplastic forming/molding methods typically available to polymeric materials, yet they possess many of the favorable properties of metallic alloys that polymers lack, such as, for example, excellent mechanical properties and robustness towards wear and adverse surrounding conditions.

2018022, Aug 9, 2018

Apr 2, 2018

15/942936

Hrayr Karnig Shahinian - Beverly Hills CA, US
Youngsam Bae - Los Angeles CA, US
Harish M. Manohara - Arcadia CA, US
Victor E. White - Altadena CA, US
Kirill V. Shcheglov - Los Angeles CA, US
Robert S. Kowalczyk - Valencia CA, US

A61B 1/00
A61B 1/045
H04N 13/211
H04N 13/254
H04N 13/214
A61B 1/06
A61B 1/05
H04N 13/257

An endoscope includes a housing with a distal end insertable into a cavity; an image capture device at the distal end to obtain 3D images, and process them to form a video signal; and a folded substrate folded into a U-shape having first and second legs. The image capture device includes a detector and a lens system with right and left multi-band pass filters having right pass bands that are complements of left pass bands. The lens system receives the 3D images including right and left images. The detector faces the lens system to obtain the right and left images. A processing circuit faces the proximal end behind the detector to process signals from the detector. The folded substrate includes the detector at an outer side of the first leg facing the lens system and the processing circuit at an outer side of the second leg facing the proximal end.

2018020, Jul 19, 2018

Jul 15, 2015

14/800436

- Pasadena CA, US
Victor E. White - Altadena CA, US
Daniel W. Wilson - Montrose CA, US
Matthew R. Dickie - Long Beach CA, US
Karl Y. Yee - Pasadena CA, US
Richard E. Muller - Altadena CA, US
James E. Polk - Pasadena CA, US
John R. Anderson - Tujunga CA, US
Nima Rouhi - Pasadena CA, US
Frank Greer - Los Angeles CA, US

California Institute of Technology - Pasadena CA

B64G 1/40

Micro-emitter arrays and methods of microfabricating such emitter arrays are provided. The microfabricated emitter arrays incorporate a plurality of emitters with heights greater than 280 microns with uniformity of +/−10 microns arranged on a supporting silicon substrate, each emitter comprising an elongated body extending from the top surface of the substrate and incorporating at least one emitter tip on the distal end of the elongated body thereof. The emitters may be disposed on the substrate in an ordered array in an X by Y grid pattern, wherein X and Y can be any number greater than zero. The micro-emitter arrays may utilize a LMIS propellant source including, for example, gallium, indium, bismuth, or tin. The substrate may incorporate at least one through-via providing a fluid pathway for the LMIS propellant to flow from a propellant reservoir beneath the substrate to the top substrate surface whereupon the micro-emitter array is disposed.