Wayne T Card, Age 644285 Douglas Ave, Corvallis, OR 97330

Wayne Card Phones & Addresses

4285 Douglas Ave, Corvallis, OR 97330 (541) 757-2753

San Diego, CA

4285 NW Douglas Ave, Corvallis, OR 97330

Work

Position: Professional/Technical

Education

Degree: High school graduate or higher

Mentions for Wayne T Card

Wayne Card resumes & CV records

Resumes

Wayne Card Photo 17

Director Of Procurement

Location:
Corvallis, OR
Industry:
Consumer Electronics
Work:
Hp
Director of Procurement
Hewlett-Packard 2009 - Oct 2015
Director of Ipg Procurement - Materials Engineering
Hewlett-Packard Aug 2008 - Oct 2009
Director of Ink Supplies Procurement
Hewlett-Packard Oct 2006 - Jul 2008
Director of Ink Mfg and Puerto Rico and South Africa Operations
Hewlett-Packard Oct 2003 - Oct 2006
Director of Business Intelligence
Hewlett-Packard Oct 2001 - Oct 2003
Director of World Wide Planning
Hewlett-Packard Mar 2000 - Oct 2001
Ww Operations Manager For Contract Manufacturing
Hewlett-Packard Jun 1993 - Mar 2000
Operations Supply Chain Section Manager
General Dynamics 1983 - 1992
Chief - Manufacturing Technology
Education:
Arizona State University 1979 - 1983
Bachelors, Bachelor of Science, Industrial Engineering
Skills:
Procurement
Wayne Card Photo 18

Wayne Card

Location:
Corvallis, OR
Industry:
Consumer Electronics
Work:
Hewlett Packard
Director of Procurement
Education:
Arizona State University 1979 - 1983
BS, Industrial Engineering
Wayne Card Photo 19

Wayne Card

Wayne Card Photo 20

Wayne Card

Publications & IP owners

Us Patents

Anti-Contamination Covers For Structure Openings

US Patent:
4615460, Oct 7, 1986
Filed:
Aug 28, 1985
Appl. No.:
6/770040
Inventors:
Ronald I. Buccellato - San Diego CA
Wayne T. Card - San Diego CA
Duane M. Foote - San Diego CA
Cinda B. Lewis - Chula Vista CA
Peter A. Soland - San Diego CA
Brian J. Stevens - San Diego CA
Philip C. Widmann - San Diego CA
Assignee:
General Dynamics Corporation/Convair Div. - San Diego CA
International Classification:
B65D 3900
US Classification:
220307
Abstract:
A cover for openings in a partially assembled missile or aircraft structure to prevent entry of chips, oil or other debris during further machining or other manufacturing operations. The cover has a central elastically compressible plug section adapted to fit snugly in an opening and an outwardly extending flange around one end of the plug. When the plug portion is inserted into the opening, the flange covers a ring of bolt holes surrounding the opening. The plug is formed from an elastic closed cell foam material and preferably has a cross-section slightly larger than the opening so as to be compressed slightly when inserted in the opening. The cover is coated with an elastomeric polyurethane coating to prevent flaking of the foam plug when inserted and removed from the opening and to prevent adhesion of contaminates to the cover. Because of the compressibility of the plug, each cover can be used with similarly configured openings of slightly varying sizes.

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