Wayne W Mulholland, Age 841724 Pelican Oval E, Azle, TX 76020

4685998, Aug 11, 1987

Oct 9, 1986

6/917040

Wayne A. Mulholland - Plano TX
Robert H. Bond - Carrollton TX
Michael A. Olla - Flower Mound TX
Jerry S. Cupples - Carrollton TX
Barbara R. Mozdzen - Carrollton TX
Charles F. Held - The Colony TX
Linda S. Wilson - Pilot Point TX
Yen T. Nguyen - Grand Prarie TX

Thomson Components - Mostek Corp. - Carrollton TX

B44C 122
B29C 3700
H01L 2348
H01L 2944

156633

An integrated circuit chip includes a top layer of dielectric penetrated by conductive vias connecting electrical contacts within the integrated circuit proper to a network of electrical leads disposed on top of the dielectric layer; the network of leads, in turn, being connected to an array of contact pads adapted for simultaneous solder connection to a leadframe.

4364620, Dec 21, 1982

Sep 5, 1980

6/261236

Wayne A. Mulholland - Plano TX
Robert J. Martin - Dallas TX
David S. Wilson - Fort Collins CO
Carlos Esparza - Lewisville TX

Mostek Corporation - Carrollton TX

H01R 1300

339 17CF

A socket (10) is described for housing similar integrated circuits (#1, #2). The socket (10) comprises a center support (14) which includes integral end panels (14a, 14b). The center support further includes a plurality of upstanding separators (42, 44) which form a plurality of recesses (46, 48). Side panels (18, 20) are joined to the center support to form first and second chambers (23, 24). A bottom plate (16) is connected to the center support (14) and side panels (18, 20). A lead frame (22) is positioned within the first and second chambers to provide metallic strips within the recesses (46, 48). In certain of the recesses the metallic strips extend from corresponding recesses in the two chambers (23, 24) and connect to a respective socket lead (12). In other selected recesses a metallic strip extends directly to connect to a package lead (12) such that there is no direct connection between common recesses. The integrated circuits (#1, #2) are positioned within the chambers (23, 24) such that the leads of the integrated circuits (#1, #2) are received within the recesses (46, 48).

4627151, Dec 9, 1986

Mar 22, 1984

6/592185

Wayne A. Mulholland - Plano TX
Daniel J. Quinn - Carrollton TX
Robert H. Bond - Carrollton TX
Michael A. Olla - Flower Mound TX

Thomson Components-Mostek Corporation - Carrollton TX

H01L 2128

29569R

A system for the assembly and packaging of integrated circuits employs circuit dice that have contact pads in a standard array; a leadframe having leads configured to have the same spring constant; a method for removing selected dice from a wafer array under computer control; and a method of simultaneously bonding all leads to the die.

4722060, Jan 26, 1988

Mar 22, 1984

6/592144

Daniel J. Quinn - Carrollton TX
Robert H. Bond - Carrollton TX
Wayne A. Mulholland - Plano TX
Steven Swendrowski - The Colony TX
Michael A. Olla - Flower Mound TX
Jerry S. Cupples - Carrollton TX
Barbara R. Mozdzen - Carrollton TX
Linda S. Wilson - Pilot Point TX
Linn Garrison - Garland TX

Thomson Components-Mostek Corporation - Carrollton TX

H01R 909
H01L 2300

364490

A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.