William M Rugg, Age 46Camas, WA

6382988, May 7, 2002

Jul 2, 1998

09/109589

William Rugg - Berthoud CO
Seah Ke Hor - Singapore, SG

Ranoda Electronics PTE Ltd. - Singapore

H01R 1200

439 82, 439 78, 439876, 361413

A compression contact ( ) for use with a complementary cylindrical contact ( ), has a pair of opposed contact faces ( ) on respective contact body portions. The contact faces ( ) are compressible inwardly, transverse to the longitudinal axis of the compression contact ( ), as the compression contact ( ) is inserted into the cylindrical contact ( ); and the contact faces ( ) are resiliently expansible outwardly to form an electrical contact with the contact face within the cylindrical contact ( ).

6865058, Mar 8, 2005

Jun 20, 2002

10/176324

Todd Warren Kube - Boulder CO, US
Alexander Wei Chang - Longmont CO, US
Bruce Lynn Blakeslee - Golden CO, US
Ernest Paul Lee - Boulder CO, US
William Leon Rugg - Longmont CO, US

Seagate Technology LLC - Scotts Valley CA

G11B005/48

3602445, 3602458

An actuator assembly includes a rotatable actuator arm mounted on the base of a disc drive. The actuator arm includes a metallic member seated on a non-metallic body. A proximal end of a load beam is mounted on the actuator arm and a distal end of the load beam supports a head. The actuator assembly also includes a connection between the metallic member and the load beam that secures the load beam to the actuator arm.

6977433, Dec 20, 2005

Oct 28, 2003

10/695192

William Leon Rugg - Longmont CO, US

Seagate Technology LLC - Scotts Valley CA

H01L023/34

257723, 257777, 257787, 257734, 257773, 438106, 438107, 438127

A multi-chip package for a computer disc drive. In a preferred embodiment, the multi-chip package (MCP) includes a first die having a buffer function thereon, such as an SDRAM device, and a second die including a channel function and a controller function thereon. The two die are packaged in a single package for placement on a printed circuit board of the disc drive.

7542231, Jun 2, 2009

Jun 24, 2003

10/602791

William Leon Rugg - Longmont CO, US
Todd Warren Kube - Boulder CO, US

Seagate Technology - Scotts Valley CA

G11B 33/14

360 9702, 3602459, 720650

A disc drive has actuator servo-controls and signal processing electronics positioned on, and electrically connected to, a flex printed circuit board positioned on a top surface of a base along with the actuator assembly and the spindle motor of the disc drive. A power combo chip is also positioned on the flex printed circuit board that is positioned on the top surface of the base. A top cover is attached to the base to form an enclosed space. The actuator assembly and the spindle motor are within the enclosed space and the actuator servo-controls and signal processing electronics are outside the enclosed space.

8239581, Aug 7, 2012

May 10, 2010

12/777236

Gabriel Ibarra - Longmont CO, US
William L. Rugg - Longmont CO, US
Nicholas C. Seroff - Boulder CO, US

Seagate Technology LLC - Cupertino CA

G06F 13/00

710 2

A data storage device comprises a data storage medium; an interface between the data storage medium and a host device configured to provide connectivity according to a plurality of storage interconnect standards. The data storage device also includes a interconnect detector configured to determine the presence of a physical connection to the host device and identify an interconnect standard of the host device, wherein the interconnect standard of the host device is one of the plurality of storage interconnect standards; and a controller configured to: receive an indication of the interconnect standard of the physical connection from the interconnect detector, receive data access commands in accordance with the interconnect standard from the host device via the connector; process the data access commands by accessing the data storage medium; and send a response to the data access commands in accordance with the interconnect standard to the host via the connector.

8250266, Aug 21, 2012

Mar 24, 2009

12/410360

William L. Rugg - Longmont CO, US
Nicholas C. Seroff - Boulder CO, US

Seagate Technology LLC - Cupertino CA

G06F 13/14

710 72, 710 2, 710 62

A data storage device comprises a data storage medium and a connector that provides an interface between the data storage medium and a host device. The connector has a shape that substantially conforms to an internal storage interconnect standard. The connector comprises a first set of electrical contacts that substantially conform to the internal storage interconnect standard, and a second set of contacts configured to provide connectivity with the host device in accordance with an external storage interconnect standard. Also described are cables for connecting the data storage device to a host via the external storage interconnect standard as well as an interconnect detector.

2005021, Sep 29, 2005

Mar 25, 2004

10/809720

William Rugg - Longmont CO, US
Robert Warren - Loveland CO, US

H01L029/40

257782000

Disclosed is a method and apparatus for stacking dice including multi-chip packaging with additional non stacked dice. The stacked dice have at least one electrical connection located on a single surface and oriented in the same direction when stacked. These dice are stacked, offset and coupled electrically. In an embodiment, the stacked dice have a buffer function, such as an SDRAM device, and are included in a multi-chip package (MCP) with an additional die including a channel function and a controller function thereon. The dice are packaged in a single package for placement on a printed circuit board for use in a storage device such as a disc drive.

2010012, May 27, 2010

Nov 24, 2008

12/277165

William Leon Rugg - Longmont CO, US

Seagate Technology, LLC - Scotts Valley CA

H01R 12/02
H05K 3/32

174262, 29842

In order to improve signal to noise ratio and reduce electromagnetic interference, it is presently contemplated to connect ground potential on an electronic package mounted to a printed circuit board directly to a commonly grounded surface of a device via an improved die ground lead with a first end connected to an electrical circuit within the electronic package, and a second end extending away from the electronic package and compressively contacting, rather than forming a bonded or soldered connection to, the commonly grounded surface. By way of example and not limitation, the improved die ground lead may be any one of a tie bar, a metal lead, a pogo pin, and a spring. The use of this configuration for the ground connection between the electrical circuit and the commonly grounded surface results in significantly less physical distance than conventional ground paths for electrical circuits within electronic packages.