Derek L Pruden, Age 4814512 Grevillea Ave, Lawndale, CA 90260

8274446, Sep 25, 2012

Jun 3, 2010

12/793448

Kyle W. Maxhimer - Hermosa Beach CA, US
David T. Winslow - Culver City CA, US
Larry L. Lai - Walnut CA, US
Derek Pruden - Redondo Beach CA, US

Raytheon Company - Waltham MA

H01Q 1/12
H01Q 21/00

343878, 343879

The present invention relates to lightweight antenna arrays and more particularly to an attachment mechanism for attaching a lightweight antenna array to a structure. In one embodiment, an antenna structure includes a platform having a first coefficient of thermal expansion; an antenna panel having a second coefficient of thermal expansion different from the first coefficient, and having first and second opposite ends; and a support structure mounting the panel to the platform. The support structure includes a first spacer element with a first height at the first end of the panel, and a second spacer element with a second height less than the first height between the first and second ends of the panel; a first adhesive layer adhering each spacer element to the platform; and a second adhesive layer adhering each spacer element to the antenna panel. A yield strength of the adhesive layers is less than a yield strength of the spacer elements.

8354595, Jan 15, 2013

Apr 21, 2010

12/764854

Kevin C. Rolston - Westchester CA, US
Alberto F. Viscarra - Torrance CA, US
Derek Pruden - Redondo Beach CA, US
Cindy W. Ma - Lawndale CA, US

Raytheon Company - Waltham MA

H05K 1/00

174254, 174262

A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.

8043464, Oct 25, 2011

Nov 17, 2009

12/620490

Hee Kyung Kim - El Segundo CA, US
Fangchou Yang - Los Angeles CA, US
Alberto F. Viscarra - Torrance CA, US
Clifton Quan - Arcadia CA, US
Derek Pruden - Redondo Beach CA, US

Raytheon Company - Waltham MA

B32B 37/00
B29C 65/00
C09J 5/04
H01Q 13/10

156292, 156182, 156314, 343770

Systems and methods for assembling lightweight RF antenna structures are provided. In one embodiment, the invention relates to a process for forming a lightweight antenna including a process for forming a first feed assembly for the antenna, the process for forming the first feed assembly including providing a flat flexible circuit substrate, providing a formed flexible circuit substrate, applying an adhesive to a plurality of locations on a surface of the flat substrate or the formed substrate, joining the flat substrate and the formed substrate using the adhesive, and heating the joined flat substrate and the formed substrate to bond the substrates.