Inventors:
Craig J. Rotay - Audubon PA, US
John Ni - San Leandro CA, US
David Lam - San Carlos CA, US
David Lee DeWire - Superior CO, US
John W. Roman - Natick MA, US
Richard J. Ross - Moraga CA, US
Assignee:
STMICROELECTRONICS, INC. - Carollton TX
RJR POLYMERS, INC. - Oakland CA
International Classification:
H01L 23/495
H01L 23/32
US Classification:
257690, 257685, 257E23194
Abstract:
A protective modular package assembly with one or more subassemblies, each having a base element, a sidewall element coupled to the base element, and a semiconductor device disposed within and coupled to the sidewall element and the base element; a protective modular package cover having fastening sections located at opposing ends of the cover, torque elements disposed on the opposing ends and configured to fasten the cover to a core, and subassembly receiving sections disposed between the fastening sections with each subassembly receiving section operable to receive a subassembly and having a cross member along the underside of the cover; and an adhesive layer configured to affix subassemblies to respective subassembly receiving sections. The torque elements are configured to transfer a downward clamping force generated at the fastening elements to a top surface of the subassemblies via the cross member of each of the one or more subassembly receiving sections.