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John M Costakis, Age 6019 Elm St, Saugerties, NY 12477

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Known as:
John C Costakis John S
Related to:
Michael M Costakis 63

John Costakis Phones & Addresses

Saugerties, NY

East Machias, ME

Butte, MT

Glasco, NY

Kingston, NY

Hyde Park, NY

Pleasant Valley, NY

Red Hook, NY

Salt Point, NY

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John M Costakis

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Work

Company: Aligned energy Aug 2011 Position: Mechanical project manager

Education

School / High School: Dutchess Community College 2011 to 2012 Specialities: Engineering

Skills

Mechanical Engineering • Metal Fabrication • Autocad • Cad • Manufacturing • Hvac • Hvac Controls

Industries

Mechanical Or Industrial Engineering

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John Costakis resumes & CV records

Resumes

John Costakis Photo 19

Mechanical Project Manager

Location:
120 Brentwood Dr, Iowa City, IA 52245
Industry:
Mechanical Or Industrial Engineering
Work:
Aligned Energy
Mechanical Project Manager
Education:
Dutchess Community College 2011 - 2012
Skills:
Mechanical Engineering, Metal Fabrication, Autocad, Cad, Manufacturing, Hvac, Hvac Controls

Publications & IP owners

Us Patents

Cooling Systems And Methods Using Two Circuits With Water Flow In A Counter Flow And In A Series Or Parallel Arrangement

US Patent:
2022031, Oct 6, 2022
Filed:
Apr 14, 2022
Appl. No.:
17/720730
Inventors:
- DANBURY CT, US
Ming Zhang - Weston CT, US
John Costakis - Glasco NY, US
Earl Keisling - Ridgefield CT, US
International Classification:
F25D 17/02
F25B 25/00
Abstract:
The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Cooling Systems And Methods Using Single-Phase Fluid

US Patent:
2023003, Feb 2, 2023
Filed:
Jul 1, 2022
Appl. No.:
17/856654
Inventors:
- DANBURY CT, US
Ken Nguyen - Danbury CT, US
Doron Shapiro - St. Louis MO, US
John Costakis - Glasco NY, US
Assignee:
INERTECH IP LLC - DANBURY CT
International Classification:
F28D 7/00
H05K 7/20
F28D 1/047
F28F 1/02
G06F 1/20
F28F 9/013
F28F 1/12
F28D 1/053
F28F 21/08
B23K 1/00
B23P 15/26
F28F 9/02
Abstract:
A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

Air Flow Distribution System For Data Center Server Racks

US Patent:
2021007, Mar 11, 2021
Filed:
Jul 14, 2020
Appl. No.:
16/928633
Inventors:
- Danbury CT, US
John Costakis - Glasco NY, US
Gerald McDonnell - Spring Hill FL, US
International Classification:
H05K 7/20
F21V 33/00
Abstract:
An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil.

Systems And Methods For Cooling Electrical Equipment

US Patent:
2021004, Feb 18, 2021
Filed:
Aug 10, 2020
Appl. No.:
16/989880
Inventors:
- Danbury CT, US
John Costakis - Glasco NY, US
International Classification:
F25B 7/00
F25B 25/00
H05K 7/20
F25B 41/04
F25B 49/02
Abstract:
The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

Systems And Assemblies For Cooling Server Racks

US Patent:
2020016, May 21, 2020
Filed:
Oct 15, 2019
Appl. No.:
16/653509
Inventors:
- Plano TX, US
John Costakis - Glasco NY, US
Gerald McDonnell - Spring Hill FL, US
Michael Welch - Ridgefield CT, US
International Classification:
H05K 7/20
H05K 5/02
Abstract:
A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Space-Saving High-Density Modular Data Systems And Energy-Efficient Cooling Systems

US Patent:
2020010, Apr 2, 2020
Filed:
Sep 11, 2017
Appl. No.:
15/701093
Inventors:
- Danbury CT, US
John Costakis - Hyde Park NY, US
Gerald McDonnell - Poughquag NY, US
International Classification:
H05K 7/20
H01L 23/473
F28D 15/00
H01L 23/34
F25D 17/00
F25B 49/00
G06F 1/20
Abstract:
A space-saving, high-density modular data pod system and an energy-efficient cooling system are disclosed. The modular data pod system includes a central free-cooling system and a plurality of modular data pods, each of which includes a heat exchange assembly coupled to the central free-cooling system, and a distributed mechanical cooling system coupled to the heat exchange assembly. The modular data pods include a data enclosure having at least five walls arranged in the shape of a polygon, a plurality of computer racks arranged in a circular or U-shaped pattern, and a cover to create hot and cold aisles, and an air circulator configured to continuously circulate air between the hot and cold aisles. Each modular data pod also includes an auxiliary enclosure containing a common fluid and electrical circuit section that is configured to connect to adjacent common fluid and electrical circuit sections to form a common fluid and electrical circuit that connects to the central free-cooling system. The auxiliary enclosure contains at least a portion of the distributed mechanical cooling system, which is configured to trim the cooling performed by the central free-cooling system.

Cooling Systems And Methods Using Single-Phase Fluid

US Patent:
2018008, Mar 29, 2018
Filed:
Sep 6, 2017
Appl. No.:
15/697445
Inventors:
- Danbury CT, US
Ken Nguyen - Danbury CT, US
Doron Shapiro - St. Louis MO, US
John Costakis - Glasco NY, US
International Classification:
F28D 7/00
F28F 9/02
F28F 1/12
B23P 15/26
B23K 1/00
Abstract:
A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

Systems And Assemblies For Cooling Server Racks

US Patent:
2017037, Dec 28, 2017
Filed:
May 9, 2017
Appl. No.:
15/590596
Inventors:
- Danbury CT, US
John Costakis - Hyde Park NY, US
Gerald McDonnell - Poughquag NY, US
Michael Welch - Ridgefield CT, US
International Classification:
H05K 7/20
H05K 5/02
Abstract:
A cooling assembly for cooling server racks includes a server rack enclosure sub-assembly that includes at least one panel member defining a volume for receiving one or more server racks having a front portion and a rear portion, at least one of the panel members is a rear panel member; at least one frame member defines an opening for receiving the rear portion of the server racks to form a hot space between the rear panel member and the combination of the frame member and the rear portion of the server racks; a cooling sub-assembly disposed in thermal communication with the hot space to cool at least one server supported in the server rack and including a chassis receiving at least one heat exchange member for exchanging heat between a refrigerant fluid flowing through the heat exchange member and fluid flowing through the hot space heated by the server.

Possible Relatives

James P Costakis  John J Last  John J Stan  John C Stanaway  John B Stanbro  John J Stanchak  John K Stanchfield  John R Stancil  John B Standefer  John A Stander 

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