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John Gerard Spadafora, Age 6919928 154Th St, Woodinville, WA 98072

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Known as:
John G Spadafora John H Spadafora John R Spadafora John G Sparafora
Related to:
Jennifer D Graham 60

John Spadafora Phones & Addresses

19928 154Th St, Woodinville, WA 98072 (425) 883-3913

Blackwood, NJ

Trenton, NJ

Snohomish, WA

Seattle, WA

Bothell, WA

Kodiak, AK

Redmond, WA

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Work

Company: Matusick, Spadafora & Verrastro Address:

Mentions for John Gerard Spadafora

Career records & work history

Lawyers & Attorneys

John Spadafora Photo 1

John Spadafora - Lawyer

Office:
Matusick, Spadafora & Verrastro
Specialties:
Matrimonial Law, Family Law, Negligence Law, Estate Law, Child Support, Tax, Bankruptcy & Debt, Divorce
ISLN:
903536071
Admitted:
1972
University:
Suny Ab; Canisius College, A.B.
Law School:
State University Of New York At Buffalo, J.D.

License Records

John A Spadafora

Licenses:
License #: RS123102A - Expired
Category: Real Estate Commission
Type: Real Estate Salesperson-Standard

John J Spadafora

Licenses:
License #: RS095511A - Expired
Category: Real Estate Commission
Type: Real Estate Salesperson-Standard

John Spadafora resumes & CV records

Resumes

John Spadafora Photo 31

Director Of Church Connections At Crossworld

Position:
Director of Church Connections at CrossWorld
Location:
Greater Philadelphia Area
Industry:
Religious Institutions
Work:
CrossWorld since 2007
Director of Church Connections
John Spadafora Photo 32

John Spadafora

Location:
United States
John Spadafora Photo 33

John Spadafora

Location:
Greater Seattle Area
Industry:
Education Management
John Spadafora Photo 34

Manufacturing Engineer At Dupont

Location:
Greater Philadelphia Area
Industry:
Mechanical or Industrial Engineering

Publications & IP owners

Us Patents

Method For Bumping Silicon Devices

US Patent:
5505367, Apr 9, 1996
Filed:
Nov 2, 1994
Appl. No.:
8/333168
Inventors:
Yinon Degani - Highland Park NJ
Thomas D. Dudderar - Chatham NJ
John G. Spadafora - Yardville NJ
Assignee:
AT&T Corp. - Murray Hill NJ
International Classification:
B23K 100
B23K 3102
US Classification:
2282481
Abstract:
The bonding pads (18) of a semiconductor chip (12) each may be provided with a solder bump (36) by first screen printing a pattern of solder paste (36) on a heat-resistant, non-wettable surface (24). The chip (12) is then placed on the surface (24) so each bonding pad (18) contacts a portion of the solder paste pattern (36). The solder paste is then reflowed, yielding molten solder that bonds to the bonding pads (18) of the chip, but not to the surface (24). After reflow, the chip, with its now-bumped pads, is removed from the surface for subsequent soldering to a wettable substrate.

Possible Relatives

Elaine Spadafora  Florence C Spadafora  Jeffrey L Spadafora  Jenny L Spadafora  Pat Spadafora  Richard J Spadafora  Rita Spadafora  John J Last  John J Stan  John C Stanaway 

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