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John D Tagle, Age 551007 Mount Pleasant Way, Cherry Hill, NJ 08034

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Known as:
John D Tangle

John Tagle Phones & Addresses

1007 Mount Pleasant Way, Cherry Hill, NJ 08034 (856) 616-9370

Haddonfield, NJ

Kokomo, IN

West Lafayette, IN

Dix Hills, NY

W Lafayette, IN

1007 Mount Pleasant Way, Cherry Hill, NJ 08034

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Mentions for John D Tagle

John Tagle resumes & CV records

Resumes

John Tagle Photo 36

Principal Mechanical Engineer

Location:
Cherry Hill, NJ
Industry:
Medical Devices
Work:
United Technologies
Principal Mechanical Engineer St. Jude Medical Sep 2009 - Aug 2010
Manufacturing Engineer Thermo Fisher Scientific Apr 2008 - Sep 2009
Senior Mechanical Engineer Optical Communication Products Feb 2003 - Nov 2007
Senior Mechanical Engineer W. L. Gore & Associates 1996 - 2003
Senior Project Engineer
Education:
Purdue University 1993 - 1995
Masters, Mechanical Engineering Cornell University 1987 - 1991
Bachelors, Mechanical Engineering
Skills:
Design For Manufacturing, Design Control, Mechanical Engineering, Iso 13485, Manufacturing, Engineering, Product Development, Design of Experiments, Engineering Management, Fmea
John Tagle Photo 37

Lead Hvac Technician

Work:
Avondale Elementary School District 44
Lead Hvac Technician
Skills:
Preventive Maintenance, Process Scheduler, Commissioning, Facilities Management, Product Development, Construction, Electricians, Hvac Controls, Contract Management, Energy Management, Maintenance and Repair, Air Conditioning, Inspection, Plumbing, Refrigeration
John Tagle Photo 38

John Tagle

Publications & IP owners

Us Patents

Substrate Subassembly For A Transistor Switch Module

US Patent:
5539254, Jul 23, 1996
Filed:
Mar 9, 1994
Appl. No.:
8/208244
Inventors:
Charles T. Eytcheson - Kokomo IN
Donald E. Lake - late of Rochester IN
Aiman I. Alhoussami - Indianapolis IN
John D. Tagle - West Lafayette IN
Timothy D. Martin - Kokomo IN
Lisa A. Viduya - Carmel IN
Frank D. Lachenmaier - Kokomo IN
Assignee:
Delco Electronics Corp. - Kokomo IN
International Classification:
H01L 23057
H01L 23373
H01L 25065
US Classification:
257691
Abstract:
A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.

Coplanar Linear Dual Switch Module

US Patent:
5523620, Jun 4, 1996
Filed:
Feb 14, 1994
Appl. No.:
8/195659
Inventors:
Charles T. Eytcheson - Kokomo IN
Todd G. Nakanishi - Kokomo IN
Michael D. Bramel - Summitville IN
John D. Tagle - West Lafayette IN
Frank D. Lachenmaier - Kokomo IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
H01L 2348
H01L 2352
US Classification:
257690
Abstract:
A readily manufacturable low inductance linear semiconductor switching module having coplanar contacts. Also disclosed is a pretestable terminal subassembly for such a module, and a method of making such a terminal subassembly. The module can contain high power, high frequency semiconductor switching devices, operating at high power but low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The terminal subassembly is readily fabricated and assembled into the module. In addition, it permits use of short internal leads that are readily connected to the terminal subassembly.

Triaxial Double Switch Module

US Patent:
5512790, Apr 30, 1996
Filed:
Jul 21, 1994
Appl. No.:
8/278199
Inventors:
Frank D. Lachenmaier - Kokomo IN
Donald E. Lake - late of Rochester IN
Timothy D. Martin - Kokomo IN
John D. Tagle - Kokomo IN
Lisa A. Viduya - Carmel IN
Assignee:
Delco Electronics Corporation - Kokomo IN
International Classification:
H01L 2507
US Classification:
307112
Abstract:
A low inductance triaxial semiconductor switching module. The module permits high power semiconductor switching devices to operated at high frequency but with low inductance. The module incorporates compositional, geometrical and electrical symmetry in connection with a triaxial terminal subassembly having coplanar contact areas. The terminal subassembly is readily fabricated and assembled into the module. The module also includes short internal leads, a special circumferential array of substrates subassemblies, and a circular circuit board having gate and Kelvin circuit patterns.

Substrate Subassembly And Method Of Making Transistor Switch Module

US Patent:
5492842, Feb 20, 1996
Filed:
Jan 30, 1995
Appl. No.:
8/381618
Inventors:
Charles T. Eytcheson - Kokomo IN
Donald E. Lake - late of Rochester IN
Aiman I. Alhoussami - Indianapolis IN
John D. Tagle - West Lafayette IN
Timothy D. Martin - Kokomo IN
Lisa A. Viduya - Carmel IN
Frank D. Lachenmaier - Kokomo IN
Assignee:
Delco Electronics Corp. - Kokomo IN
International Classification:
H01L 2100
US Classification:
437 7
Abstract:
A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.

Multi-Tiered Tamper-Resistant Assembly System And Method

US Patent:
2016026, Sep 8, 2016
Filed:
Mar 4, 2015
Appl. No.:
14/638808
Inventors:
- Princeton NJ, US
John Tagle - Cherry Hill NJ, US
Dmitry Zhilinsky - Princeton NJ, US
Michael A. Liland - Princeton NJ, US
Laszlo Kovacs - Middlesex NJ, US
Leonardo C. Gonzales - West Chester PA, US
Assignee:
Sensors Unlimited, Inc. - Princeton NJ
International Classification:
H04N 5/378
H01L 23/00
H04N 5/33
G06T 5/40
H04N 5/32
H01L 27/146
H01L 23/29
Abstract:
A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Possible Relatives

Ernesto Tagle  Gloria E Tagle  Jason Tagle  Patricia Tagle  Robert L Tagle  Romeo M Tagle  Ruth L Tagle  John J Last  John J Stan  John C Stanaway 

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