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Kevin GuanSan Francisco, CA

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Related to:
Eme N Ke 54 Pei T Kawai 50 Shao Qi Quan 69 Shirley Y Guan 40 Norio M Kawai 88

Kevin Guan Phones & Addresses

San Francisco, CA

245 Amazon Ave, San Francisco, CA 94112 (415) 987-9138

Education

Degree: High school graduate or higher

Emails

k***[email protected]

Mentions for Kevin Guan

Career records & work history

License Records

Kevin Guan

Licenses:
License #: E109442 - Expired
Category: Emergency medical services
Issued Date: Jul 10, 2014
Expiration Date: Oct 31, 2016
Type: Los Angeles County EMS Agency

Publications & IP owners

Us Patents

Die Offset Die To Bonding

US Patent:
7674653, Mar 9, 2010
Filed:
Dec 9, 2008
Appl. No.:
12/316041
Inventors:
Nguk Chin Lai - Penang, MY
Kevin Guan - Richmond CA, US
Kwet Nam Wong - Penang, MY
Cheng Sim Kee - Penang, MY
Sally Foong - Milpitas CA, US
Assignee:
Spansion LLC - Sunnyvale CA
International Classification:
H01L 21/00
US Classification:
438109, 257E23052
Abstract:
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.

Die Offset Die To Die Bonding

US Patent:
7750481, Jul 6, 2010
Filed:
Dec 9, 2008
Appl. No.:
12/316042
Inventors:
Nguk Chin Lai - Penang, MY
Kevin Guan - Richmond CA, US
Kwet Nam Wong - Penang, MY
Cheng Sim Kee - Penang, MY
Sally Foong - Milpitas CA, US
Assignee:
Spansion LLC - Sunnyvale CA
International Classification:
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257777, 257E23003
Abstract:
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.

Die Offset Die To Die Bonding

US Patent:
2008030, Dec 18, 2008
Filed:
Jun 18, 2007
Appl. No.:
11/820278
Inventors:
Nguk Chin Lai - Penang, MY
Kevin Guan - Richmond CA, US
Kwet Nam Wong - Penang, MY
Cheng Sim Kee - Penang, MY
Sally Foong - Milpitas CA, US
International Classification:
H01L 23/48
H01L 21/60
US Classification:
257777, 438109, 257E21506, 257E2301
Abstract:
A semiconductor die is provided on a spacer, the die having first and second opposite edges which extend beyond respective first and second opposite edges of the spacer, the first edge of the die extending beyond the first edge of the spacer to a lesser extent than the second edge of the die extends beyond the second edge of the spacer. Furthermore, a first semiconductor die has a plurality of bond pads thereon, a second semiconductor die has a plurality of bond pads thereon, and a substrate has a plurality of bond pads thereon. Each of a first plurality of wires connects a bond pad on the first semiconductor die with a bond pad on the second semiconductor die, and each of a second plurality of wires connects a bond pad on the second semiconductor die with a bond pad on the substrate.

Possible Relatives

Jian M Guan  Jing Guan  Ming H Guan  Ning G Guan  Shang X Guan  Sue S Guan  Xiang Y Guan  Kevin R Johnson  Kevin B Stanaland  Kevin B Johnston 

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