Michael C Gulla, Age 47150 Hancock St, Everett, MA 02149

6632344, Oct 14, 2003

Mar 24, 2000

09/535302

Robert L. Goldberg - Sharon MA, 02067
Michael Gulla - Sarasota FL, 34238

C25D 554

205159, 205220, 205164, 205125

The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.

4869970, Sep 26, 1989

Nov 9, 1987

7/118439

Michael Gulla - Newton MA
Terrell A. Benjamin - Acton MA
Mark Farsi - Worcester MA

Shipley Company Inc. - Newton MA

B32B 1504

428621

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

3977884, Aug 31, 1976

Jan 2, 1975

5/538125

Michael Gulla - Sherborn MA
Charles A. Gaputis - Hyde Park MA

Shipley Company, Inc. - Newton MA

C23C 302

106 1

An electroless metal plating solution is characterized by an elemental sulfur stabilizer, either in colloidal or soluble, non-ionic form. Elemental sulfur as a stabilizer is an improvement over prior art stabilizers as it can be used in substantially larger concentration than prior art divalent sulfur stabilizers which are catalytic poisons.

4551409, Nov 5, 1985

Nov 7, 1983

6/549286

Michael Gulla - Sherborn MA
Paul Taylor - North Andover MA
Michael J. Oddi - Burlington MA

Shipley Company Inc. - Newton MA

G03C 160
G03C 171
G03F 726

430192

A photoresist composition comprising a sensitizer in a binder that is a naphthol polymer alone or mixed with another compatible resin such as a novolak resin or a polyvinyl phenol. The use of the naphthol resin as a portion of the binder increases the heat distortion temperature of the photoresist composition.

5391421, Feb 21, 1995

Nov 15, 1993

8/153072

Michael Gulla - Millis MA

Shipley Company Inc. - Marlborough MA

B32B 900

428209

A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

4810333, Mar 7, 1989

Dec 14, 1987

7/132175

Michael Gulla - Millis MA
Donald F. Foust - Scotia NY
George K. Philipose - Waltham MA

Shipley Company Inc. - Newton MA

C25D 502
C25D 556

204 15

A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

4725314, Feb 16, 1988

Sep 17, 1986

6/908277

Michael Gulla - Sherborn MA
Oleh B. Dutkewych - Harvard MA
John J. Bladon - Wayland MA

Shipley Company Inc. - Newton MA

B22F 700
C09D 500
C23C 1600
B05B 118

106 111

A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.

5158860, Oct 27, 1992

Nov 1, 1990

7/607711

Michael Gulla - Millis MA
Prasit Sricharoenchaikit - Millis MA

Shipley Company Inc. - Newton MA

G03C 558

430315

A process for selective metallization comprising the steps of providing a substrate coated with a photoresist, imaging the photoresist coating by exposure to pattern radiation and development, flood exposing the photoresist coating to activating radiation, depositing an electroless plating catalyst over the entire imaged photoresist coating and bared underlying substrate, removing the top surface of the flood exposed, catalyzed photoresist coating by development whereby plating catalyst remains in a desired selective pattern and depositing metal over the catalyzed surface to form a metal deposit in a selective pattern such as in a circuit pattern. The process is suitable for the manufacture of diverse articles including printed circuit boards.