Timothy Wooldridge resumes & CV records
Resumes
Timothy J Wooldridge, Age 66PO Box 818, Wills Point, TX 75169
Timothy Wooldridge Phones & Addresses
1999 Vz County Road 3812, Wills Point, TX 75169 (214) 354-5583
Terrell, TX
Mount Vernon, TX
1109 Griffith Ave, Terrell, TX 75160 (972) 524-3416
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Timothy J Wooldridge
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Work
Position:
Food Preparation and Serving Related Occupations
Mentions for Timothy J Wooldridge
Publications & IP owners
Us Patents
Wafer Processing Apparatus
US Patent:
4875989, Oct 24, 1989
Filed:
Dec 5, 1988
Appl. No.:
7/283036
Inventors:
Cecil J. Davis - Greenville TX
Robert T. Matthews - Plano TX
Lee M. Loewenstein - Plano TX
Joe V. Abernathy - Wylie TX
Timothy A. Wooldridge - Richardson TX
Robert T. Matthews - Plano TX
Lee M. Loewenstein - Plano TX
Joe V. Abernathy - Wylie TX
Timothy A. Wooldridge - Richardson TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
C23C 1434
C23F 102
C23F 102
US Classification:
204298
Abstract:
A processing apparatus and method for edge-preferential processing of partially fabricated integrated circuit wafers or of other substantially flat and thin workpieces. A plasma remote from the workpiece is used to generate activated species, and a baffle which is in proximity to the wafer face but not in contact with it is used to direct the stream of activated species. This module can be set up to perform both edge bead removal and bake of spun-on photoresist.
Advanced Vacuum Processor
US Patent:
4842680, Jun 27, 1989
Filed:
May 2, 1988
Appl. No.:
7/188633
Inventors:
Cecil J. Davis - Greenville TX
Timothy J. Wooldridge - Richardson TX
Duane E. Carter - Plano TX
Timothy J. Wooldridge - Richardson TX
Duane E. Carter - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
B44C 122
H01L 21306
C03C 1500
C03C 2506
H01L 21306
C03C 1500
C03C 2506
US Classification:
156643
Abstract:
A complete integrated circuit processing module, wherein multiple processing stations, each with its own vacuum isolation, are located inside a single module which is held at hard vacuum. A wafer transport arm mechanism permits interchange of wafers among the processing stations and a load lock. The load lock is equipped to remove and replace wafers from a vacuum-sealed wafer carrier. The wafers remain face-down and under hard vacuum during all the wafer handling steps.
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