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Sriram S Srinivasan, Age 621631 Wrenwood Lks, Houston, TX 77043

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Known as:
Sriram S Rinivasan Sriram Srinvasan
Related to:
Anshuman V Srinivasan 27

Sriram Srinivasan Phones & Addresses

Houston, TX

Scottsdale, AZ

Katy, TX

4373 Winding Creek Rd, Manlius, NY 13104 (315) 682-1892

5 Wildflower Dr, Hebron, CT 06248 (860) 228-8603

Farmington, CT

Vernon Rockville, CT

Charlottesville, VA

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Mentions for Sriram S Srinivasan

Career records & work history

License Records

Sriram Srinivasan

Licenses:
License #: ="27740" - Active
Issued Date: Oct 9, 2009
Renew Date: Dec 1, 2015
Expiration Date: Nov 30, 2017
Type: Certified Public Accountant

Sriram Srinivasan resumes & CV records

Resumes

Sriram Srinivasan Photo 33

Regional Entity, Manager Of Regulatory Interface And Process Improvement

Location:
Pensacola, FL
Industry:
Utilities
Work:
Fvc
General Manager Finance and Operations Callidus Consulting Llc May 2014 - Oct 2014
Financial Consultant Sig Combibloc Obeikan Fzco Sep 2007 - Oct 2013
Deputy Chief Financial Officer Southwest Power Pool Sep 2007 - Oct 2013
Regional Entity, Manager of Regulatory Interface and Process Improvement Redington Gulf Aug 2004 - Aug 2007
Finance Manager-Middle East and Africa United Engineering & Automobile May 1998 - Jun 2004
Accounts Manager Pentasoft Mar 1997 - Mar 1998
Financial Analyst Abb Apr 1996 - Feb 1997
Executive American Express Aug 1994 - Aug 1995
Industrial Trainee
Education:
Acca 2002 - 2004
Cima 1996 - 2004
The Institute of Chartered Accountants of India 1992 - 1995
Rkm Vivekandana College 1992
Bachelors, Bachelor of Science University of Madras 1989 - 1992
Bachelors, Bachelor of Science, Mathematics Vana Vani Matriculation Higher Secondary School 1981 - 1989
University of Houston 1984 - 1988
Master of Business Administration, Masters, Business University of Houston 1978 - 1983
Bachelors, Bachelor of Science, Electrical Engineering
Skills:
Consolidation, Managerial Finance, Financial Reporting, Cash Flow, Working Capital Management, Forecasting, Internal Controls, Financial Analysis, Ifrs, Finance, Cash Management, Business Planning, Financial Audits, Sap, Internal Audit, Treasury, Variance Analysis, Auditing, Accounting, Strategic Financial Planning, Corporate Finance, Financial Accounting, Process Improvement, Accounts Payable, Cost Accounting, Accounts Receivable, Mis, Sarbanes Oxley Act, Budgets, Analysis, Business Process Improvement, Financial Planning
Languages:
English
Hindi
Tamil
Sriram Srinivasan Photo 34

Principal Software Engineering Manager

Location:
1 Tanager Ln, Cranbury, NJ 08512
Industry:
Computer Software
Work:
Microsoft
Principal Software Engineering Manager Philips Mar 2006 - Jun 2013
Senior Scientist Kth Royal Institute of Technology Mar 2002 - Dec 2005
Doctoral Student University of Erlangen-Nuremberg Apr 2005 - Jun 2005
Visiting Researcher
Education:
Kth Global Development Hub 2002 - 2005
Doctorates, Doctor of Philosophy, Telecommunications Sri Sathya Sai Institute of Higher Learning 1994 - 2001
Master of Science, Masters, Mathematics, Computer Science
Skills:
Signal Processing, Speech Processing, Statistical Signal Processing, Audio Processing, R&D, Software Engineering, Program Management, C, Matlab, Dsp, Research Project Management
Sriram Srinivasan Photo 35

Senior Vice President, Global Technology

Location:
Houston, TX
Industry:
Oil & Energy
Work:
Halliburton
Senior Vice President, Global Technology Southwest Windpower Mar 2009 - Feb 2011
Vice President of Engineering Carrier Corporation Nov 2004 - Feb 2009
Engineering Director Pratt & Whitney Nov 1996 - Nov 2004
Manager, Structures Discipline Group United Technologies Research Center Nov 1993 - Nov 1996
Senior Research Engineer
Education:
University of Virginia 1986 - 1993
Master of Science, Doctorates, Masters, Doctor of Philosophy, Aerospace Engineering
Skills:
Engineering, Engineering Management, Product Development, Manufacturing, Management, Program Management, Oil and Gas, Energy, Cross Functional Team Leadership, Project Management, Petroleum, Six Sigma, Strategy, Mechanical Engineering, Aerospace, Industrial
Sriram Srinivasan Photo 36

Sriram Srinivasan

Sriram Srinivasan Photo 37

Sriram Srinivasan

Sriram Srinivasan Photo 38

Sriram Srinivasan

Sriram Srinivasan Photo 39

Sriram Srinivasan

Location:
United States
Work:
NYU Langone Medical Center 2012 - 2012
CTO
Skills:
Business Alignment

Publications & IP owners

Us Patents

Engineering Standard Work Framework Method And System

US Patent:
7496860, Feb 24, 2009
Filed:
Jun 30, 2004
Appl. No.:
10/881343
Inventors:
Vivek Saxena - West Hartford CT, US
Sriram Srinivasan - Hebron CT, US
Joseph Adams - S. Glastonbury CT, US
Assignee:
United Technologies Corporation - Hartford CT
International Classification:
G06F 3/048
G06F 17/50
US Classification:
715853, 715764, 705 7
Abstract:
A method and system for managing complex projects uses a framework having workflow maps containing activity blocks that provide detailed, easily accessible information within the framework about the project. The framework links functional groups, their associated activities, and the dependences between activities. The detailed, prescriptive instructions provided at each stage in the process creates in-process quality control, reducing the likelihood of costly mistakes and turnbacks. Implementing the framework as a web-based application allows easy access to the framework as well as data entered into the framework for future analysis, making it easy to identify improvement opportunities in the framework.

Direct Power Delivery Into An Electronic Package

US Patent:
7629680, Dec 8, 2009
Filed:
Mar 22, 2006
Appl. No.:
11/387512
Inventors:
Brent M. Roberts - Phoenix AZ, US
Sriram Srinivasan - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/52
US Classification:
257691
Abstract:
In some embodiments, direct power delivery into an electronic package is presented. In this regard, a substrate is introduced having a conductive substrate core designed to physically connect with a power cable. Other embodiments are also disclosed and claimed.

Microelectronic Package And Method For A Compression-Based Mid-Level Interconnect

US Patent:
8278752, Oct 2, 2012
Filed:
Dec 23, 2009
Appl. No.:
12/646854
Inventors:
Brent M. Roberts - Phoenix AZ, US
Mihir K. Roy - Chandler AZ, US
Sriram Srinivasan - Chandler AZ, US
Sridhar Narasimhan - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/34
H01L 23/48
US Classification:
257726, 257723, 257696, 257692, 257697, 257698, 257E23146
Abstract:
A microelectronic package includes first substrate () having first surface area () and second substrate () having second surface area (). The first substrate includes first set of interconnects () having first pitch () at first surface () and second set of interconnects () having second pitch () at second surface (). The second substrate is coupled to the first substrate using the second set of interconnects and includes third set of interconnects () having third pitch () and internal electrically conductive layers () connected to each other with microvia (). The first pitch is smaller than the second pitch, the second pitch is smaller than the third pitch, and the first surface area is smaller than the second surface area.

Patch On Interposer Through Pga Interconnect Structures

US Patent:
8381393, Feb 26, 2013
Filed:
Dec 30, 2009
Appl. No.:
12/655406
Inventors:
Brent M. Roberts - Phoenix AZ, US
Mihir K. Roy - Chandler AZ, US
Sriram Srinivasan - Chandler AZ, US
Sridhar Narasimhan - Chandler CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01K 3/10
US Classification:
29825, 257696, 257726
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include attaching a patch to an interposer, forming at least one interconnect structure above and on a top surface of the interposer; and attaching a flex connector to the at least one interconnect structure.

Patch On Interposer Assembly And Structures Formed Thereby

US Patent:
8389337, Mar 5, 2013
Filed:
Dec 31, 2009
Appl. No.:
12/655588
Inventors:
Brent M. Roberts - Phoenix AZ, US
Mihir K. Roy - Chandler AZ, US
Sriram Srinivasan - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/60
US Classification:
438124, 438118, 438121, 438126, 438E21506
Abstract:
Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Mistuned Rotor Blade Array For Passive Flutter Control

US Patent:
2002006, Jun 6, 2002
Filed:
Dec 4, 2000
Appl. No.:
09/729046
Inventors:
Matthew Montgomery - Jupiter FL, US
W. Byrne - North Palm Beach FL, US
Rachel Block - Greer SC, US
Peter Silkowski - Middletown CT, US
Sriram Srinivasan - Hebron CT, US
International Classification:
F01D005/16
US Classification:
416/203000, 416/500000
Abstract:
The present invention relates to an improved array of flow directing elements for incorporation in turbomachinery. In accordance with the present invention, an array of flow directing elements comprises a plurality of flow directing elements mounted to a rotor disk. The plurality of flow directing elements includes a first set of first flow directing elements whose natural vibration frequency has been modified by having material removed from a leading edge tip region and a second set of second flow directing elements whose natural vibration frequency has been modified by having material removed from a midspan leading edge region. The array may further comprise unmodified flow directing elements arranged with the modified flow directing elements.

Forming A Substrate Core With Embedded Capacitor And Structures Formed Thereby

US Patent:
2006014, Jul 6, 2006
Filed:
Dec 30, 2004
Appl. No.:
11/027386
Inventors:
Sriram Srinivasan - Chandler AZ, US
John Guzek - Chandler AZ, US
Cengiz Palanduz - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Joel Auernheimer - Phoenix AZ, US
International Classification:
H01G 7/00
H01G 4/20
US Classification:
029025410, 361312000, 029846000
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

Forming A Substrate Core With Embedded Capacitor And Structures Formed Thereby

US Patent:
2006014, Jul 6, 2006
Filed:
Sep 2, 2005
Appl. No.:
11/218357
Inventors:
Sriram Srinivasan - Chandler AZ, US
John Guzek - Chandler AZ, US
Cengiz Palanduz - Chandler AZ, US
Victor Prokofiev - Phoenix AZ, US
Joel Auernheimer - Phoenix AZ, US
International Classification:
H01G 4/228
US Classification:
361306300
Abstract:
Methods of forming a microelectronic structure are described. Embodiments of those methods include forming a substrate core by attaching a first dielectric layer to a second conductive layer of a thin film capacitor, and attaching a second dielectric layer to a first conductive layer of the thin film capacitor.

Possible Relatives

Ganesan Srinivasan  Jaya L Srinivasan  Jayaram S Srinivasan  Krishna Srinivasan  Kumar S Srinivasan  Lakshmi Srinivasan  Mahesh S Srinivasan  Sriram Ramanathan  Sriram P Narayanan  Sriram Swaminathan 

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